EDI CON Online
Title: Avoiding Board Fabrication Pitfalls in High Speed & RF Designs
Date: August 11, 2021
Time: 11:30am PT / 2:30pm ET
Presented by: Julie Ellis, Field Applications Engineering Manager, TTM Technologies, Inc.
Today’s fine-pitch components and high speed digital and RF designs often push the limits of material and circuit board fabrication capabilities. Creating stack-ups that meet both customer requirements and fabricator capabilities are sometimes like solving multiple-solution puzzles without knowing about all the pieces. This presentation will discuss misunderstood pieces and how things can go wrong when they are not put together correctly. Q&A will include Andy Cameron, Field Applications Engineer at TTM Technologies.
Julie Ellis is a Field Applications Engineering Manager for TTM Technologies, the third largest circuit board fabricator in the world. She enjoys using technical expertise gained from years of personal experience, reinforced by TTM’s extensive global engineering team, to help her customers design circuit boards that are manufacturable, reliable, and as cost effective as possible.