eBook Library
Please note:
By downloading an eBook, the details of your profile will be shared with the sponsoring company and you may be contacted by them directly.
The material presented in these PDF documents is owned by the sponsoring company and Signal Integrity Journal™. It is presented here to be downloaded by an individual for educational purposes. It may not be downloaded from this site and reposted elsewhere.
eBooks by Content Type:
New eBooks:
SIJ April 2026 Issue: AI-Assisted HFSS Modeling For 100 GHz+ High-Speed Interconnect Design
Subscribe or login to download this April 2026 issue of Signal Integrity Journal which highlights AI in SI/PI and other important SI/PI topics in the following articles:
- AI-Assisted HFSS Modeling for 100 GHz+ High-Speed Interconnect Design Jason Yoho, Ameya Ramadurgakar, and Madrone Coopwood, HYPERLABS
- Why Power Architectures Constrain New Space AI Missions, Ken Coffman, Vicor
- Machine Learning Models for SI\PI Analysis with Meshed Planes Jiyue Zhu, Regina Thahir, Xiaoyan Xiong, Gang Kang, and Jian Liu, Cadence
- Stop Breaking the Loop: Modern Closed–Loop Stability in ADS Benjamin Dannan, Signal Edge Solutions, Steve Sandler, Picotest, and Heidi Barnes, Keysight Technologies
- Evolution of the PDN Design Process: Explaining the Second Paradigm Shift Istvan Novak, Samtec
- When Frequency Shapes Times: How S-Parameter Properties Shape Simulated TDR Behavior Tim Wang Lee, Keysight Technologies
- PAM2 vs. PAM4 Signaling: Simply Explained Bert Simonovich, LAMSIM Enterprises
_______________________________________________________________________________________________
SIJ October 2025 Issue: Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms
Subscribe or login to download this October 2025 issue of Signal Integrity Journal which highlights AI technology and other important SI/PI topics in the following articles:
- The Impact of AI at the Singularity, Eric Bogatin, Signal Integrity Journal
- Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms, Jared James and Ambrish Varma, Cadence Design Systems
- The Imperfect Via: The Rough Truth Lurks Beneath the Surface, Bert Simonovich, Lamsim Enterprises
- High-Speed Digital Interface Characterization Requires New Test Approach, Hiroshi Goto, Anritsu Company
- Using Ultra-Broadband Baluns to Perform Differential S-Parameter Measurements Using Single-Ended 2-Port VNA, Madrone Coopwood, Jason Yoho, and James R. Andrews, HYPERLABS
- Material-Induced Skew in High-Speed Multilayer PCBs: Influences and Mitigation Strategies, Bob Nurmi, John Coonrod, and Vitali Judin, Rogers Corporation
- Seeing Through the Noise: Reliable Power Rail Measurements in High-Current AI Systems, Seamus Brokaw, Tektronix, and Steve Sandler, Picotest
- ManyPoint Networks: A System Co-Design Framework for 448 Gbps AI Fabrics and Beyond, Andrew Josephson, Samtec
_______________________________________________________________________________________________
Challenges in High-Speed Interconnect Guide
As data rates push well beyond 100 Gbps per lane and system architects’ eye 400G, 800G, and emerging terabit-class links, high-speed interconnects have become one of the most critical elements of modern electronic systems. Whether enabling AI fabrics, cloud data centers, advanced test and measurement platforms, or next-generation networking equipment, interconnect performance now defines overall system reliability, efficiency, and scalability. Challenges in High-Speed Interconnect Guide brings together a curated set of expert articles that address the practical, measurement, modeling, and architectural issues engineers face as signal integrity margins continue to shrink.
_______________________________________________________________________________________________
SIJ January 2025 Issue: How to Simulate Low Voltage, High Power 2000 Amps to a Dynamic Digital Load
Subscribe or login to download this issue of Signal Integrity Journal featuring articles from industry experts including:
- “The Need for Speed and the Cost in Power,” Eric Bogatin, Signal Integrity Journal
- “How to Simulate Low Voltage, High Power 2000 Amps to a Dynamic Digital Load,” Heidi Barnes, Keysight Technologies; Steve Sandler, Picotest; and Benjamin Dannan, Signal Edge Solutions
- “Reflections on the Origins of COM,” Rich Mellitz, Samtec
- “Ultrafast Impedance Measurement of Active Ultra-High Current PDNs,” Steve Sandler, Picotest
- “How Interconnects Work: Crosstalk Quantification,” Yuriy Shlepnev, Simberian Inc
- “Analysis of Skew,” Gustavo Blando and Prashant Pappu, Amazon Web Services
- “A Subtle Problem to Avoid in Your Next Design,” Eric Bogatin, Signal Integrity Journal, and Dheeraj Gooty, University of Colorado Boulder
- “Created by Engineers, for Engineers: DesignCon Celebrates 30 Years,” Suzanne Deffree, DesignCon
_______________________________________________________________________________________________
Signal Analysis Solutions
The articles compiled in this eBook explore a diverse range of topics with practical insights and emerging strategies aimed at engineers, system architects, and technical decision-makers. We begin with “The Future of Wireless: Technologies Overcoming 5G Struggles,” an exploration of the current hurdles facing 5G/6G deployments—such as spectrum limitations and coverage. In “Wideband IQ Emulation and Analysis for RF Design and Debug,” we delve into the expanding role of wideband I/Q signal generation and analysis in supporting modern RF systems. This article outlines the techniques and instrumentation making that possible. The hardware used in signal analysis is also undergoing a transformation, and “Evolution of Interconnects in Benchtop RF Test” covers how modern interconnect solutions are improving performance, reducing signal loss, and enhancing test repeatability. “Advanced Power Integrity Measurement Solutions” addresses the challenges of maintaining stable, noise-free power in densely packed, high-speed circuits. Wireless systems are only as good as their antennas, and “Evaluating Antenna Testing Options” reviews a variety of test environments, from anechoic chambers to over-the-air (OTA) setups. Finally, in “Noise in Traffic: Signal Emulation for Automotive Apps,” we tackle the complexities of testing communication systems within the increasingly electrified and connected automotive landscape. Simulating realistic traffic noise and signal interference is essential to ensuring vehicle systems remain safe and effective under all conditions. Each article in this collection offers a view into the challenges and solutions shaping the world of signal analysis. Together, they reflect a shared goal: empowering engineers and developers to push the limits of what’s possible with confidence and precision.
_______________________________________________________________________________________________
Crosstalk Challenges and Solutions Guide
This Crosstalk Challenges and Solutions Guide eBook is a resource aimed at helping engineers and de¬signers understand the nuances of crosstalk, its causes, and its potential impact on system performance. Through a carefully curated collection of articles, we dive into the fundamentals of crosstalk, explore ad¬vanced analysis techniques, and present practical solutions to mitigate its effects. Whether you are design¬ing PCBs, high-speed interconnects, or complex SoC architectures, this guide equips you with the knowl¬edge and tools to tackle crosstalk effectively. This guide does more than explain the theory behind crosstalk and signal integrity—it provides actionable solutions that engineers can implement in their designs. From optimal trace routing and differential pair spacing to advanced simulation techniques and material selection, the articles in this eBook offer practical insights to minimize crosstalk and improve overall system performance.
_______________________________________________________________________________________________
Signal Integrity Measurement and Analysis Guide
In today’s high-speed digital and RF systems, maintaining signal integrity is paramount to ensuring reliable performance. As data rates increase and systems become more complex, engineers face a growing number of challenges in accurately measuring and analyzing signal behavior. This eBook, Signal Integrity Measurement and Analysis Guide, provides an overview of key concepts and methodologies used to evaluate signal integrity, including Channel Operating Margin (COM), eye patterns, crosstalk, skew, and data center measurement challenges.
_______________________________________________________________________________________________
Latest Trends in Power Integrity
As the demand for faster, smaller, and more efficient electronic devices grows, ensuring that power delivery net¬works (PDNs) can meet the stringent requirements of advanced technologies is paramount. In addition, new chip designs are requiring higher and higher currents in the thousands of amps range. This eBook, "Latest Trends in Power Integrity," explores advancements and methods for managing and optimizing power integrity in modern systems. From ultrafast impedance measurements to the intricate analysis of decoupling capacitors, this guide will provide insights into the emerging challenges and solutions in the world of power integrity.
_______________________________________________________________________________________________
Test & Measurement Guide and Tips
This eBook covers a range of advanced concepts, from understanding the bandwidth of signals to conducting in-depth real-time analysis, and addresses the challenges faced by today’s engineers in keeping up with rigorous standards and ever-evolving requirements. The first article dives into the fundamentals of bandwidth of signals, exploring how bandwidth impacts system performance and the importance of selecting the right tools for capturing signal data accurately. Moving into more sophisticated territory, we address embedded systems debug with jitter and real-time dye analysis. Embedded systems are increasingly complex, requiring robust debugging tools to maintain reliable performance under tight timing constraints. This section covers jitter—a key parameter in time-domain analysis that can impair data accuracy—and how it can be mitigated using advanced tools. The guide also compares spectrum analyzers: GPSA vs. RTSA. General purpose spectrum analyzers (GPSA) and real-time spectrum analyzers (RTSA) each have unique advantages and limitations. Finally, we look at power integrity testing, an area of growing significance as electronic systems become more power-dense and sensitive to fluctuations. Power integrity impacts everything from processor stability to overall system longevity, and effective testing requires specialized tools and methodologies.
_______________________________________________________________________________________________
Power Integrity Measurement Guide
In today’s high-performance electronic systems, power integrity (PI) has become a critical design and operational factor. With the increasing complexity of circuits, higher frequencies, and shrinking geometries, ensuring stable and clean power delivery across all components is essential. Unstable power supplies can result in signal integrity issues, degraded performance, or even system failure.
This eBook aims to serve as a resource for engineers, designers, and technical professionals looking to understand and improve power integrity in their systems by covering some new topics in this area. The articles cover interconnect requirements for power integrity testing, measuring high output voltage regulator noise, advanced power integrity measurement solutions, why measuring only board-level power rail noise may be misleading, and solving PI problems in FPGA systems.
_______________________________________________________________________________________________
High Speed Interconnect Solutions Guide
The importance of high-speed interconnect solutions cannot be overstated. Whether powering the backbone of global telecommunications networks, accelerating the data processing capabilities of cloud computing infrastructure, or enhancing the performance of consumer electronics, these solutions are the foundation upon which modern connectivity is built. This eBook guide covers interconnect design challenges for 224G systems and PCIe 6.0 plus the various testing techniques needed to evaluate and test these systems. The introductory article also covers some history of how we have progressed from 1 Gbps NRZ to 224 Gbps PAM4 so is a nice perspective on the evolution of interconnect technology.
_______________________________________________________________________________________________
Identifying and Solving EMC/EMI Problems
The need to address EMC/EMI problems has never been more pressing. As electronic devices become smaller, faster, and more powerful, the potential for interference grows exponentially. It's no longer sufficient to simply design and build electronic systems without considering their EMC/EMI characteristics. Engineers, designers, and technicians must proactively identify and mitigate these issues to ensure that their products meet regulatory standards, perform reliably, and avoid costly setbacks. This eBook provides an understanding of the underlying principles, practical methodologies, and advanced techniques for dealing with EMC/EMI challenges. It is designed for both newcomers seeking a foundational knowledge of the subject and experienced professionals looking to deepen their expertise.
_______________________________________________________________________________________________
Getting the Jitter Out - High Speed Communications Timing Technology
This eBook focuses on jitter, simply defined as any effect that causes signal threshold crossing times to deviate from their expected positions. The first article addresses the inter-relationships between jitter and other noise-generating mechanisms.
_______________________________________________________________________________________________
End-to-End High-Speed Digital Design
High-speed digital links at 224 Gbps per lane, device miniaturization, and ultra-low power budgets result in sophisticated systems that are more complex to optimize signal integrity performance and reliability. Engineers require close collaboration and seamless flows from concept to simulation, emulation, and testing to keep up with technology's pace and meet shrinking time-to-market expectations.
This eBook covers how to connect design workflows to make end-to-end high-speed digital design a reality. It will discuss the challenges and trade-offs associated with optimizing design performance for technologies such as PCIe 6.0, USB4 Version 2.0, and USB-C, DDR5, and LPDDR.
