To ensure you get high performance at a system and component level, while at the same time saving between 15% and 50% in decoupling capacitor (decap) costs, Cadence® Sigrity™ OptimizePI™ technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs.
Cadence® Sigrity™ SystemSI™ signal integrity (SI) solutions provide a comprehensive and flexible SI analysis environment for accurately assessing high-speed, chip-to-chip system designs. The solutions support industry-standard model formats and automatically connect the models. 
Uniquely equipped to let you perform a broad range of signal- and power-integrity studies in a single step, Cadence® Sigrity™ SPEED2000™ technology is a layout-based time-domain simulation tool for IC package and/or board design. Sigrity SPEED2000 technology combines circuit and transmission-line simulations with a fast, special-purpose full-wave electromagnetic field solver.
The Cadence® Allegro® Sigrity™ PI design and analysis environment streamlines the creation of power delivery networks (PDNs) on high-speed and high-current PCB systems and IC packages. A range of capabilities enable you to explore, optimize, and resolve issues related to electrical performance at all stages of the design cycle. The solution integrates tightly with Cadence PCB and IC package layout editors.
Cadence® Sigrity™ PowerSI® 3D EM Extraction Option is three-dimensional (3D) full-wave and quasi-static electromagnetic field (EM) solver technology tailored for IC package and PCB design’s S-parameter model extraction for power-integrity (PI) and signal-integrity (SI) analysis. The adaptive finite element mesh (FEM) refinement technology provides consistent accuracy for complicated 3D structures.
The Cadence® Sigrity™ PowerDC™ environment provides fast and accurate DC analysis for IC packages and PCBs along with thermal analysis that also supports electrical and thermal co-simulation. Targeting both pre- and post-layout applications, the Sigrity PowerDC approach enables you to quickly identify IR drop, current density, and thermal issues that are among the leading field failure risks.
The Cadence® Allegro® Sigrity™ signal integrity (SI) integrated high-speed design and analysis environment streamlines creation of high-speed interconnect on digital PCB systems and IC packages. A range of capabilities—from basic to advanced—enable designers and electrical engineers to explore, optimize, and resolve issues related to electrical performance at all stages of the design cycle.
The Cadence® Sigrity™ PowerSI® environment provides fast and accurate full-wave electrical analysis of leading-edge IC packages and PCBs to overcome increasingly challenging design issues such as simultaneous switching noise (SSN), signal coupling, problematic decoupling capacitor implementations, and design regions that are under or over target voltage levels.