Articles by TE Connectivity

Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.

TE Connectivity (TE), has introduced its high-power pin and socket product portfolio, addressing high current rating demands from high-speed board-to-board and board-to-busbar data communication applications. The portfolio currently includes ICCON Block and ICCON Insert connectors. 

TE Connectivity extends its small form-factor pluggable (SFP) product portfolio with small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects.

TE Connectivity (TE), announced the launch of its STRADA Whisper cable receptacles, which can allow engineers to start designing for up to 112G PAM-4 data rates in servers, switches, and routers. 

TE Connectivity (TE), is introducing an M8/M12 cable assembly solution for Fieldbus data communications, complementing its existing sensor/actuator cable assembly solutions for industrial networks.

TE Connectivity (TE) has introduced zSFP+ stacked belly-to-belly connectors that are designed to support data rates at both 28G NRZ and 56 Gbps PAM-4. 

TE Connectivity introduced its PCIe Gen 4 card edge connectors, which meet industry PCI-SIG Card Electromechanical (CEM) specification 4.0 and support Intel and AMD next-generation platforms with up to 16 Gbps of bandwidth.

TE Connectivity, a world leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.