Michael Degerstrom

Michael J. Degerstrom received a BSEE from the University of Minnesota. Mike is currently a Senior Engineer at the Mayo Clinic Special Purpose Processor Development Group. His primary area of research and design has been in the specialty of signal and power integrity.



Plated-Through-Hole Via Design Specifications for 112G Serial Links

Recent studies indicate that the industry is nearing the precipice where plated through hole via technology has reached a limit in supporting serial links with 28 GHz Nyquist frequency requirements. At DesignCon2021, a team from the Mayo Clinic presented this paper about their work to extend the “life” of conventional PCB technology.

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