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Sivers Semiconductors AB announced a collaboration with Jabil, in which Jabil plans to develop a 1.6T LRO transceiver module using Sivers’ high-performance DFB lasers.
Advantest announced the opening of two Advantest Innovation Centers, one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif.
Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure.
Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root.
Teledyne e2v announced the start of full production of its 16 GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications.
EnSilica has been selected to join the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the U.K. Department for Science, Innovation & Technology (DSIT).
Emerson announced details of its annual NI Connect conference, being held May 12-14 at the Fort Worth Convention Center under the theme “Productivity Reimagined.”
Molex has completed the acquisition of Smiths Interconnect, marking a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives.
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