Industry News

Microchip's Plug-In Timing Module Delivers Precise, Reliable Synchronization for Data Centers and 5G Networks to Meet the Demands of AI and Next-Generation Connectivity

Thu, 23 Apr 2026 00:00:00 -0400

AT&S Advances Glass Core Substrates for AI, High-Performance Computing and Photonics

Wed, 22 Apr 2026 00:00:00 -0400

Advanced Chip and Circuit Materials Introduces Negative and Near-zero CTE Materials

Mon, 20 Apr 2026 10:06:50 -0400

ACCM launched two new materials: Celeritas HM50 and Celeritas HM001.

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Mon, 20 Apr 2026 09:24:01 -0400

This article will explore the key role of digitizers in enabling state-of-the-art SSOCT systems and explain why Teledyne digitizers, including the ADQ32 and ADQ35, provide the performance, flexibility, and advanced features required by SS-OCT instrument developers striving to build next-generation imaging solutions.

Amazon to Acquire Globalstar

Sun, 19 Apr 2026 00:00:49 -0400

Amazon.com, Inc. and Globalstar, Inc. announced that they have entered into a definitive merger agreement under which Amazon will acquire Globalstar, enabling Amazon Leo to add direct-to-device (D2D) services to its low Earth orbit satellite network and extend cellular coverage to customers beyond the reach of terrestrial networks.

Rohde & Schwarz to Host Power Electronics Online Conference “From Design to Validation” in May

Sun, 19 Apr 2026 00:00:27 -0400

Rohde & Schwarz will host the Power Electronics Online Conference “From Design to Validation” on May 5 and 6, 2026.

Sivers Semiconductors Collaborates With Jabil on Energy Efficient 1.6T Pluggable Optical Transceiver Module

Wed, 15 Apr 2026 08:51:13 -0400

Sivers Semiconductors AB announced a collaboration with Jabil, in which Jabil plans to develop a 1.6T LRO transceiver module using Sivers’ high-performance DFB lasers.

Samtec Cable Assemblies Test 224 Gbps PAM4

Wed, 15 Apr 2026 08:26:38 -0400

Samtec, Inc. announced the release of the BE71A Bulls Eye^® Phase & Amplitude Stable Test Assembly.

Advantest Announces Opening of Strategic Innovation Center

Tue, 14 Apr 2026 11:21:39 -0400

Advantest announced the opening of two Advantest Innovation Centers, one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif.

Orbital Sets Date for First Test Mission to Put AI Data Centers in LEO

Tue, 14 Apr 2026 08:01:01 -0400

Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure.

ACCM Celeritas™ SF1600 Delivers Zero-Skew for PCIe 7, 224 Gbps and Beyond

Mon, 06 Apr 2026 12:55:19 -0400

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root.

Teledyne e2v Started Production of 16 GB DDR4 -X1 Flight Models for Space Applications

Fri, 03 Apr 2026 08:10:40 -0400

Teledyne e2v announced the start of full production of its 16 GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications.

Worldwide Telecom Capex to Decline in 2026

Thu, 02 Apr 2026 08:37:52 -0400

According to a recently published report from Dell’Oro Group, worldwide telecom investments were stable in 2025.

EnSilica Joins UK CHERI Adoption Collective to Accelerate Secure-by-Design Silicon

Tue, 31 Mar 2026 08:03:12 -0400

EnSilica has been selected to join the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the U.K. Department for Science, Innovation & Technology (DSIT).

AI-Driven Productivity to Take Center Stage at NI Connect 2026

Sun, 29 Mar 2026 00:00:25 -0400

Emerson announced details of its annual NI Connect conference, being held May 12-14 at the Fort Worth Convention Center under the theme “Productivity Reimagined.”

Molex Completes Acquisition of Smiths Interconnect

Sun, 29 Mar 2026 00:00:15 -0400

Molex has completed the acquisition of Smiths Interconnect, marking a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives.

Rohde & Schwarz Amplifiers Enable High-field Immunity Testing Expansion at IB Lenhardt Lab

Tue, 24 Mar 2026 08:16:13 -0400

IBL Lab GmbH, the DAkkS-accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities with a substantial investment in a suite of high-power amplifier systems from Rohde & Schwarz.

Teledyne LeCroy Product Launch: CP1000

Mon, 23 Mar 2026 09:48:18 -0400

Teledyne LeCroy introduces the CP1000, a 1000 Arms AC/DC current probe with DC to 1.5 MHz bandwidth, designed for accurate, high‑current measurements in motor drives, traction inverters, and high‑power systems.

New Vishay Intertechnology Space-Grade Common Mode Choke Provides EMI Filtering for GaN and SiC Switching Applications

Wed, 18 Mar 2026 12:25:09 -0400

Vishay Intertechnology, Inc. introduced a new space-grade, surface-mount common mode choke designed to provide EMI filtering and noise suppression in demanding space, aerospace and defense applications.

Keysight Advances AI Networking with Ultra Ethernet LLR and CBFC Interoperability Demonstration at OFC 2026

Tue, 17 Mar 2026 11:16:13 -0400

Keysight Technologies, Inc. announced it has achieved the industry’s first public interoperability demonstration of Ultra Ethernet Consortium (UEC) specification with Link Layer Retry (LLR) and Credit-Based Flow Control (CBFC) at 800GE line rate, in collaboration with Broadcom at OFC 2026.

Teledyne SP Devices Introduces High-Speed Disk Streaming with ADQ35 and libads for Extreme Data Capture

Tue, 17 Mar 2026 11:04:55 -0400

Teledyne SP Devices recently announced a major advancement in high‑speed data acquisition through the combined capabilities of its high-speed ADQ3 data acquisition board family and the proprietary libads NVMe streaming library.

Siemens Launches Fuse EDA AI Agent for Automation Across Semiconductor, 3D IC and PCB System Workflows

Tue, 17 Mar 2026 08:23:42 -0400

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off.

Samtec AcceleRate® Slim Cable Assemblies Available with New Signaling Options

Sun, 15 Mar 2026 00:00:37 -0400

Samtec, Inc announced production quantity availability of single-ended and mixed single-ended / differential pair signaling options using AcceleRate^® Slim Cable Assemblies.

Cloud Providers Boost Total Telecom in 2025

Fri, 13 Mar 2026 08:27:18 -0400

Dell’Oro Group has just wrapped up its 4Q25 telecom equipment reports across Broadband Access, Microwave & Optical Transport, Mobile Core, RAN and Service Provider Router, showing the market returning to growth in 2025 after two years of contraction.

Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

Wed, 11 Mar 2026 13:23:28 -0400

Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio and FITS-8CH, the suite’s first product.

Samtec to Exhibit at OFC 2026, Participate in OIF Interoperability Demo

Wed, 11 Mar 2026 08:12:10 -0400

Samtec, Inc. will be demonstrating next-generation, high-performance optical and copper interconnect solutions in South Hall booth #1101 at the upcoming OFC exhibition

Rohde & Schwarz Opens Larger Office in Japan to Increase its Support for the Japanese Automotive Market

Mon, 12 Jan 2026 09:13:54 -0500

Rohde & Schwarz has opened a new larger office in Osaki, Japan, with increased capabilities, to deliver an innovation advantage for the Japanese automotive community.

Infineon Announces CoolGaN Bidirectional Switch and CoolGaN Smart Sense for Higher Performance and More Cost-Effective Power Systems

Tue, 04 Jun 2024 00:00:47 -0400

Infineon Technologies AG today announced two new CoolGaN product technologies, CoolGaN bidirectional switch and CoolGaN Smart Sense.

Vodafone Business and Lenovo Connect Partnership to Increase Connectivity and Security for Customers Across Europe

Thu, 02 Mar 2023 00:00:48 -0500

Vodafone Business and Lenovo Connect have collaborated to offer a customized global IoT connectivity service, allowing customers with Lenovo smart devices to securely connect to the internet through Vodafone's global network across multiple countries.

Keysight Expands EDA Software Portfolio with the Acquisition of Cliosoft