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SiTime® Corporation introduced the Elite X™ Super-TCXO® for edge networks such as data centers, 5G front haul, connected cars, and industrial IoT. In these applications, Elite X solves critical timing problems and enables delivery of services. 

Supplied in a multi-chip package (MCP) format, each Teledyne e2v DDR4T04G72 memory features expansive bus capabilities, where 64bits are assigned to data transfer and an additional 8bits for error correction. The DDR4T04G72 is an optimal companion for the company’s own Qormino® processors, and is also compatible with most processors, SoCs, and FPGAs from other vendors.

Rohde & Schwarz launches its LCR meter family of high performance general purpose impedance testers covering a wide range of applications. With its supported frequency range from 4 Hz to 10 MHz, the R&S LCX is ideal not only for the majority of devices operating at conventional 50 or 60 Hz domestic power frequencies.

Aitech Systems now offers the space industry’s first standalone small form factor (SFF) Ethernet switch designed and tested for near earth orbit (NEO) and low earth orbit (LEO) missions. The S-A6640.

The TD99102 UltraCMOS^® High-speed FET and GaN transistor driver offering very high switching speed of 20 MHz. The flip chip part is ideal for driving Teledyne HiRel’s 100 V high reliability GaN HEMT devices in DC-DC, AC-DC converters, orbital Point-of-Load (POL) modules and space motor drives.

“Spectra is the only source of electronics industry business intelligence that is combining end-to-end data from supply chain, design, and manufacturing sectors,” 

The TO247PLUS package offers a greater creepage distance for easy design-in. EDT2 technology is optimized for traction inverter and has a breakdown voltage of 750 V, supporting battery voltages up to 470 V _DC, and significantly lower switching, and conduction losses.

3U 12-slot backplane aligns with The Open Group Sensor Open Systems Architecture™ (SOSA) Technical Standard 1.0. The backplane is an update to Elma’s original CMOSS reference backplane supporting the U.S. Army’s latest open standards requirements. The 3U OpenVPX backplane offers a mix of plug-in card slots that enable complex, high speed signal processing and system development, supporting up to 100 Gigabit Ethernet.

Flex Power Modules has expanded its range of 2” x 1” encapsulated, through-hole DC/DC converters with the addition of three of the latest parts with single outputs of 24 V (21.6-26.4 V), 48 V (43.2-52.8 V) and 54 V (48.6-59.4 V). The parts retain the wide 8:1 input range of the PKE8000A series, suiting nominal inputs of 12 V, 24 V, 28 V or 48 V for a wide range of industrial, transportation, RFPA, and IT applications.

NXP® Semiconductors has launched the S32G GoldVIP to help address real-time and application development challenges of software-defined vehicles using S32G vehicle network processors. This groundbreaking vehicle integration platform offers multiple value propositions for S32G processor evaluation, software development, and rapid prototyping efforts.