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 Realtek Semiconductor, the market leader in integrated circuits (IC) for the past 30 years, has launched the second generation of its 2.5GbE chip.

Keysight Technologies, Inc. announced the first 256 GSa/s arbitrary waveform generator (AWG), Keysight's M8199A, with 65 GHz analog bandwidth in a compact two-slot AXIe module.

Viavi Solutions Inc., introduced the first 16-lane protocol analysis system for PCI Express^® 5.0, operating at 32 Gbps per lane. The VIAVI Xgig 5P16 Protocol Analyzer delivers detailed traffic analysis and jamming capabilities, enabling test and validation to meet the most demanding performance needs of emerging compute-intensive applications.

TE Connectivity (TE), has introduced its high-power pin and socket product portfolio, addressing high current rating demands from high-speed board-to-board and board-to-busbar data communication applications. The portfolio currently includes ICCON Block and ICCON Insert connectors. 

Silicon Labs has introduced a family of small form factor, high-performance crystal oscillators (XOs) and voltage-controlled crystal oscillators (VCXOs) for applications that require low jitter and frequency-flexible clock synthesis. The Si54x/6x Ultra Series  XO/VCXOs deliver jitter performance as low as 80 femtoseconds (fs) for integer and fractional frequencies across the entire operating range.

The hybridNETBOX is an instrumentation platform for applications that require simultaneous signal generation and acquisition. Six models are available offering the choice of two, four, or eight pairs of matched AWG and digitizer channels.

Rohde & Schwarz announces the launch of the R&S FSW-B8001 option. It extends the internal analysis bandwidth of the R&S FSW high-end signal and spectrum analyzer to 8.3 GHz.

Kyocera Corporation announced its 5811 series board-to-board connectors, miniaturized to be about 50 percent smaller than conventional products and optimized for wearable devices. The 5811 series connectors feature a 0.35mm-pitch to save space, perform well in high current and are highly durable.

TE Connectivity extends its small form-factor pluggable (SFP) product portfolio with small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects.

Molex, announces the expansion of its industry-leading NearStack High-Speed Cable Solutions to include the NearStack 100 Ohm and NearStack 85 Ohm solutions. The extended portfolio helps organizations manage costs, reduce insertion loss, and improve signal integrity.