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SMD pulse transformers for Gigabit Ethernet and PoE

February 6, 2018
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TDK Corporation has expanded the ALT4532 series of pulse transformers with new types for Gigabit Ethernet and Power over Ethernet (PoE) applications. The new ALT4532P type is designed for emerging 2.5GBASE-T (2.5 Gbit/s) and 5GBASE-T (5 Gbit/s) LAN applications as well as 1000BASE-T (1 Gbit/s) applications with 600-mA PoE.


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Anritsu Company to Address High-speed Testing Requirements Associated with Emerging and Next-generation Technologies at DesignCon 2018

February 1, 2018
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Anritsu Company (booth #741), a Diamond Sponsor of DesignCon 2018, will host a series of technical sessions and conduct live testing demonstrations that aid engineers in verifying emerging and next-generation high-speed designs during DesignCon 2018, to be held in Santa Clara, CA, January 30 – February 1, 2018. Among the technologies to be addressed by Anritsu will be PCI Express® (PCIe®), Thunderbolt, USB 3.0, 200G/400G PAM4, and 56G PAM4.


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Teledyne LeCroy Announces New PCIe® 4.0 Multi-Lead and MidBus Probes

February 1, 2018
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DesignCon 2018 -- Teledyne LeCroy Inc., today announced the availability of new PCI Express PCIe 4.0 Multi-Lead (solder down) and MidBus Probes for its Summit™ PCI Express 4.0 Protocol Analyzers. Both the PCIe Multi-Lead and MidBus probes, when used with a PCIe 4.0 Protocol Analyzer, enable testing at up to x16 link widths at 16 GT/s speeds using Teledyne LeCroy's latest T.A.P4 technology.


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TE Connectivity enables future of 400GbE at DesignCon 2018

OSFP, QSFP-DD products support emerging ethernet standard
January 31, 2018
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TE Connectivity (TE), a leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices.


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TE Connectivity and Credo pave the way for 112G single lane connectivity

Live demonstration for the first time at DesignCon 2018
January 31, 2018
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TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies.


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