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SiTime Corporation, the precision timing company, announced that it will provide its precision timing solutions to Lattice Semiconductor, the low power programmable leader.
RFMW announced today that it has completed a significant brand refresh. The new look incorporates the expanding power management offering in the company’s portfolio.
ATIS’ Next G Alliance announced the publication of two new reports, "Sustainable 6G Connectivity—A Powerful Means of Doing Good" and "AI-Native Wireless Networks."
Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
According to Dell’Oro Group, preliminary readings suggest that worldwide telecom capex increased at a low-single digit rate year-over-year in nominal USD terms in 2022, down from the high-single digit growth in 2021.
Teledyne LeCroy announced availability of new PCI Express 6.0 EDSFF interposers based on new Teledyne LeCroy TAP6 technology that reduces signal integrity issues for enhanced probing in high-speed projects.
Nexperia’s NEH2000BY will enable the development of electronic devices that are self-powered, smaller, and environmentally friendly. This energy harvesting solution can help mitigate the environmental impact of the billions of batteries produced and discarded each year.
Leading industry voice of Ethernet celebrates technology’s 50 years of innovation in 2023 with cutting-edge multivendor demo, new Ethernet roadmap, and OFCnet participation.