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Abracon expands its line of high-performance ClearClock™ oscillators with the addition of the brand new AK2A and AK3A-series oscillators.

To provide long-distance and reliable USB solutions to the market, Microchip Technology announces two new reclocker/redriver devices. 

Transtector has released a new line of outdoor AC panel surge protectors with high-capacity metal oxide varistor technology.

Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE IEDM has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Liquid Instruments, a leading innovator in software-defined instrumentation, announced the release of Moku Version 3.0 for its flexible, FPGA-based Moku:Pro, Moku:Lab, and Moku:Go products.

In their latest report, Yole Group delivers a comprehensive understanding of the technology and market trends, describes the underlying technologies, the supply chain that drives it, and its competitive landscape.

ZTE Corporation announced that its R5300 G5 server has shattered the world record in the SPEC CPU 2017 test, showcasing outstanding performance.

Flex Power Modules and Bear VAI Technology are coming together to offer and support the Flex Power Modules range of DC/DC conversion products in the Midwest U.S.

The increasing demand for data processing is the primary driving force behind the growth in four key application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies.

EDI CON China 2024 returns to Beijing and the Chinese National Convention Center April 9-10 with an industry exhibition as well as a technical conference.