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Molex has released the results of a survey exploring top trends, technology innovations, and evolving career skills impacting design engineers at aerospace and defense companies. 

Infineon´s CoolGaN transistors enable reliable, high-performance solutions and help UMEC develop safer and energy-efficient technology to address modern power system challenges. 

Infineon has expanded its CoolSiC MOSFETs 400 V G2 portfolio with the top-side-cooled TOLT package as well as the TO-247-3 and TO-247-4 packages. In addition, three new products in the TOLL package have been introduced, with rated voltages of 440 V (continuous) and 455 V (transient). 

ProLabs proudly announces its participation in the SCTE TechExpo25, taking place in Washington, D.C. from September 29 to October 1.

Teledyne Labtech, a leading innovator in advanced electronic PCB solutions, is spearheading a pioneering Welsh disruptive technology that could revolutionize thermal management in space electronics. 

Yole Group announced the release of its Automotive White Paper, Vol. 2, part of the 2025 Yole Group White Paper Collection. 

Nordson Electronics Solutions announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials.

Samtec announces the expansion of its AcceleRate® HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5 mm stack height.

RIGOL Technologies has unveiled the RSA6000 Series Real-Time Spectrum Analyzer, built on the newly upgraded UltraReal platform. 

The version 0.3 development milestone marks the completion of the first review draft of the specification and confirms that PCI-SIG is on track for a full PCIe 8.0 specification release by 2028.