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Richardson RFPD today announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.

Silicon Labs and Calnex Solutions today announced a proven reference design for ITU-T G.8262-compliant Synchronous Ethernet (SyncE) applications at 25G and 100G Ethernet rates. The solution is based on the Marvell^® Alaska^® C family of high-speed Ethernet transceivers, Silicon Labs’ Si5348 low-jitter network synchronizer clock and the Calnex Paragon-100G test platform.

Hirose, the designer and manufacturer of connector solutions, has designed an intrafacility fiber cable (IFC) assembly system that supports bidirection optical transmission of 6.25Gbps and unidirection up to 12.5Gbps (6.25Gbps x 2ch). The high-speed BF4-IFC Series cable assembly integrates the BF4M Series active optical connector into a rugged circular shell with a superior push-pull design for quick and easy mating/unmating operation.

Samtec proudly supports the release of the new ANSI/VITA 74.0-2017 Small Form Factor Base Standard. VITA 74, also referred to as VNX, defines both the mechanical and electrical standards necessary for a small form factor (SFF) system.

New Yorker Electronics has released the new Vishay Dale IHXL-2000VZ-5A Very High-Current Through-Hole Inductor. The new Vishay IHXL technology combines the metal composite construction of a pressed metal powder with an insulating binder which allows for high saturation magnetization and high field strength – so it handles high transient current spikes without saturation.

Paragraf, the graphene technology development company, a recent spin out from the University of Cambridge, has closed a £2.9 million seed round to support the development of its first major products. The round is led by Cambridge Enterprise, the commercialization arm of the University of Cambridge, with the participation of Parkwalk Advisors, Amadeus Capital Partners, IQ Capital Partners and angel investors.

TE Connectivity (TE) announced the release of its new CII FC-335 series relay. Designed to manage harsh inductive, motor and lamp loads, this high-performance relay offers a rugged means of power switching in a range of aerospace, defense and marine applications.  TE’s new relays are built to handle higher capacity loads, offering a 35 Amps/28Vdc resistive load rating.

Würth Elektronik eiSos expands its product series of power modules with high power density, very few external components and outstanding electromagnetic compatibility. The step-down converter with variable output voltage is a particularly compact solution in a LGA-6EP package (dimensions 3.2 × 2.5 × 1.6 mm).

EDI CON China 2018 enjoyed a year of record growth in both attendance and exhibition space March 20-22, 2018 at the China National Convention Center (CNCC) in Beijing. In its sixth year, EDI CON China continues to be the largest microwave and high speed digital design conference and exhibition in China.