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At this week’s IEEE IEDM 2018 conference, imec presents a first demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration approach with a 45nm fin pitch and 110nm poly pitch technology.

TE Connectivity (TE), introduces its new high density plus (HD+) card edge power connectors, which delivers the highest current density of any card edge power connectors. Capable of supporting power supplies up to 3kW, these connectors are designed to enable systems with increasing power requirements in next-generation data centers.

PLDA and Samtec, today announced a demo of their combined PCIe 4.0 solution that delivers full PCIe 4.0 bandwidth (16 GT/s) over copper or optical fiber at minimal cost.

Keyssa®, announced its Virtual Pipe I/O (VPIO) architecture that enables I/O to scale with processor/memory performance and allows product designers to develop new classes of products. 

EDI CON USA 2018 took place in Santa Clara Convention Center on October 17 and 18, and as part of its technical program, EDI CON USA presents its Outstanding Paper Awards.

Teledyne LeCroy announced it has released the world’s first high-definition arbitrary waveform generators (AWGs). The dual-channel AWGs are branded T3AWG3252 (250 MHz) and T3AWG3352 (350 MHz) and offer 16 bits of vertical voltage resolution, an output voltage window of up to ±24 V, and waveform memory of up to 1 GS/channel.

Keysight Technologies, Inc. announced that the company has been selected as an electronic design automation partner by ON Semiconductor, delivering a design solution for power devices that increases reliability and accelerates time-to-market.

Dialog Semiconductor plc, a provider of custom and configurable power management, AC/DC power conversion, charging and Bluetooth® low energy technology today announced its first fully-integrated nanopower PMICs for IoT applications, the DA9070 and DA9073.

The new power supply series consists of the R&S NGE102B with two channels and the R&S NGE103B with three channels. They are suitable for various applications in education and production as well as in R&D labs. With these new features, Rohde & Schwarz is addressing the educational sector in particular.

EDI CON China 2019, a conference that brings together engineers working on high frequency analog and high speed digital designs, taking place April 1-3, 2019 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open.