We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.
Vicor Corporation has released three automotive-grade power modules for 48V EV systems that deliver industry-leading power density and will support automotive OEM and tier one production in 2025.
By combining their advanced simulation, software model development, and validation techniques, Modelithics and SES will collaborate to address critical challenges faced by high-speed electronic and power electronic systems designers.
The power electronics supply chain has undergone a phase of rapid expansion in manufacturing capacity, particularly for SiC and silicon devices, as well as SiC wafers.
In this installment, Steve Sandler discusses measuring new ultra-low impedance PDNs using newly created usable test standards in the 20 µΩ range for accurate results.
Menlo Micro will develop a first of its kind, high-current advanced circuit breaker for power distribution for the Naval Nuclear Propulsion Program’s Advanced Technology Innovation Pipeline Program
This paper comprehensively addresses the numerous challenges presented when designing a power distribution network for a scalable 2000 Amp power supply and provides a complete process for designing, simulating, and validating a 2000 Amp core power rail.
RSS
