DesignCon 2018 -- Teledyne LeCroy Inc., today announced the availability of new PCI Express PCIe 4.0 Multi-Lead (solder down) and MidBus Probes for its Summit™ PCI Express 4.0 Protocol Analyzers. Both the PCIe Multi-Lead and MidBus probes, when used with a PCIe 4.0 Protocol Analyzer, enable testing at up to x16 link widths at 16 GT/s speeds using Teledyne LeCroy's latest T.A.P4 technology.

The Teledyne LeCroy PCIe 4.0 Multi-lead and MidBus probes allow developers using an embedded PCI Express bus in their PCB designs to tap into the signal traces directly and capture each serial lane, allowing flexibility to connect to any accessible points on the surface of the PCB. Each connection minimizes perturbation of the PCI Express bus signal using T.A.P4 technology while providing a reliable capture of all PCI Express traffic.  Each Probe can support link widths of up to x8 unidirectional or x4 bi-directional using MultiPort mode at up to 16GT/s speeds.  Multiple Midbus probes can also be used to simultaneously capture up to x16 bi-directional traffic. Sideband signals are also supported on a separate cable attachment. Both probe types support SRIS clocking when access to host and device clock is made available. "Teledyne LeCroy is now in its fourth generation of Multi-lead and MidBus probe solutions for PCI Express," said John Wiedemeier, Teledyne LeCroy Protocol Solutions Group Senior Product Marketing Manager. "Many new high speed I/O embedded applications will be utilizing PCI Express 4.0 technology. Developers depend on Teledyne LeCroy's robust probing design and high signal integrity for data analysis and measurement. The Multi-lead and MidBus probes for PCI Express 4.0 will extend the probing reach of developers, bringing powerful analysis tools to solve their system issues and keep them on track with their project schedules."

Engineers involved in developing PCIe based connections rely on Teledyne LeCroy PCI Express 4.0 protocol analyzer tools for identifying, diagnosing errors and solving interoperability and performance issues. The intuitive views, including built-in protocol translations, hierarchical display, real-time statistics, protocol traffic summaries, detailed error reports, powerful scripting and the ability to create user defined test reports allow developers to troubleshoot intricate problems and finish their projects on time. With these probes, engineers can capture and analyze PCIe 4.0, NVMe, NVMe-MI and SMBus traffic and monitor sideband signaling such as PERST# and WAKE# in a point to point connection. 

For additional information, contact Teledyne LeCroy (1-800-553-2769) or visit Teledyne LeCroy's web site at