This application note presents an efficient methodology for modeling 3D interconnects incorporating hatched return planes in silicon interposers, silicon bridges, and flex PCBs. The approach combines a specially designed quasi-static 2D field solver with full 3D electromagnetic analysis within a mixed-domain modeling framework.
Please note:
By downloading this white paper, your contact information will be shared with the sponsoring company, and you may be contacted by them directly via email or phone for marketing or advertising purposes.