YINCAE announced that they have developed DA158N die attach materials, which are thermal conductive, and electrical insulating adhesives. It can be fast cured at low temperatures; the development of DA 158N is preparing for people to live on Mars. 

Due to its inimitable properties, DA 158N die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness with no bleeding or migration issue. Furthermore, the DA 158N has excellent bonding strength, and a thermal cycling performance that is significantly greater than that of the leading competitors. The DA 158N can withstand extreme temperatures ( -273°C) without any delamination, and still outperform current products on the market. This not only has implications for the use of DA 158N, but also indicates the broad range of uses it potentially has across current industries. 

This material can be used for all die attach application, particularly for harsh condition application. It is also ideal for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. 

Designed for high production and friendly environment, where process speed and reliability are the key concerns, this material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.