MACOM Technology Solutions Inc., today announced availability of production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G optical modules targeting Cloud Data Center applications. The new MATA-03820 and the MATA-03819 are available in flip chip and wire bonding packaging options, respectively, for fast, flexible deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules.
Delivering industry-leading low noise performance less than 1.5 uA RMS typical and supporting bandwidth up to 35 GHz, MACOM’s MATA-03820 and MATA-03819 TIA family supports high throughput optical data links in a very low power profile, optimal for use in high density optical Data Center interconnects. Features include RSSI for photo-alignment and power monitoring, and I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain and other key parameters.
“Molex is excited to collaborate with MACOM. Leveraging MACOM’s technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry leading 400G optical modules,” said Adit Narasimha, Vice President and General Manager, Molex Optoelectronics. “The low noise performance of MACOM’s TIA along with its flexible programmability, enable delivery of industry leading low bit error performance when implemented with a DSP for 400G modules.”
“In the rapid evolution to single fiber 100G and parallel fiber 200G and 400G connectivity, we believe that MACOM has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximize bandwidth density in the Cloud Data Center,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “MACOM’s MATA-03820 and MATA-03819 TIA family, complemented by a comprehensive portfolio of seamlessly-interoperable MACOM components, is helping our customers accelerate this transition.”
MACOM’s MATA-03820 and MATA-03819 TIAs are available to customers today in production quantities. For more information about the products, visit-
For customers targeting APD applications, MACOM is now sampling its MATA-03921 (flip chip) and MATA-03919 (wire bonded) TIAs.
MACOM will be hosting demonstrations of their expanded PAM-4 chipset for 100G, 200G and 400G applications at OFC 2019, featuring the MATA-03820 and MATA-03819 TIAs in customer module implementations and a live 200G/400G ROSA demonstration. OFC 2019 attendees are invited to visit with MACOM at the San Diego Convention Center, California, in the MACOM InnovationZone at booth #2739. For more information about MACOM’s high-performance optical networking solutions for Cloud Data Centers, visit www.macom.com/data-center.