We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Infineon Technologies, a global leader in power semiconductors and IoT, has published the 2026 edition of its annual GaN Insights, providing valuable awareness into the world of GaN technology, its applications, and future prospects.
Infineon introduces the EZ-USB™ FX2G3, a next-generation USB 2.0 peripheral controller designed to deliver superior performance, robust security, and advanced power efficiency for USB devices.
Infineon has announced that AMD has tested its 64 Mb HYPERRAM memory and HYPERRAM controller IP for use with the AMD Spartan UltraScale+ FPGA SCU35 Evaluation Kit, enabling the AMD MicroBlaze V soft-core RISC-V processor with cost-effective, high-bandwidth memory.
The IPOSIM from Infineon Technologies AG is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.
Designed for point of load power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems.
Infineon has launched the CoolSiC™ MOSFETs 1400 V G2 in the TO-247PLUS-4 Reflow package. The devices support higher DC-link voltages and enable improved thermal performance, reduced system size and enhanced reliability.
Infineon is further advancing on its path to become a leading GaN powerhouse and bolstering its position as the world’s leader in automotive semiconductors by introducing its first GaN transistor family qualified to the AEC standard for automotive applications.
