Items Tagged with 'wafer'

At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber sealant, a material system designed to deliver low thermal impedance while significantly reducing mechanical stress on chips.

Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.

Cerebras Systems’ new semiconductor boasts 1.2 trillion transistors and will turbocharge AI applications.