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Socionext announced the
availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for
consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging.
AMD Versal AI Edge XQRVE2302 becomes the second radiation-tolerant device in the space-grade Versal adaptive SoC portfolio to be qualified for spaceflight, having achieved Class B qualification.
Silicon Labs announced their new xG22E family of wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.
