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Teledyne e2v announced the start of full production of its 16 GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications.
NHanced Semiconductors uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Their new Besi bonding system further expands its advanced packaging yield and throughput.
President Joe Biden signed a presidential determination authorizing the use of Defense Production Act to support the nation’s domestic printed circuit boards and advanced packaging industrial base.
Mercury Systems, Inc. announced the latest development in its high density secure memory product line, integrating double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) with its SWaP-efficient packaging technology.
