Signal Integrity Journal Summit Series

Title: SIJ Summit: SI/PI

Date: July 29, 2026

Time: 10am PT / 1pm ET

Sponsored by: COMSOL, Keysight, Altium and Teledyne LeCroy

Abstract:
As data rates climb and system complexity intensifies, ensuring robust signal and power integrity is more critical than ever. This half-day online summit brings together industry experts to explore the latest techniques, tools, and design methodologies for managing noise, minimizing jitter, and optimizing power delivery networks. Attendees will gain practical insights into high-speed channel design, advanced simulation strategies, and measurement best practices—equipping engineers to meet the challenges of next-generation electronic systems.

Moderator: Benoit Derat, Editor, Signal Integrity Journal
Panelist: Andrew Strikwerda, Lead Application Engineer, COMSOL
Panelist: Hee-Soo Lee, High-Speed Digital Segment Lead, Keysight
Panelist: Alexsander Tamari, Technical Marketing Engineer, Altium
Panelist: Dr. Patrick Connally, Product Architect, Teledyne LeCroy

Panel Participant Bios:

Moderator – Signal Integrity Journal
Benoit Derat, Editor

Benoit Derat earned his engineering degree from SUPELEC in 2002, followed by a Ph.D. with honors in physics from the University of Paris XI, Orsay, in 2006. His early career at SAGEM Mobiles saw him deeply involved in antenna design and electromagnetic research. In 2009, he founded ART-Fi, where he introduced the first vector-array specific absorption rate measurement system, serving as both CEO and President. In 2017, Benoit moved to Munich to join Rohde & Schwarz, leading diverse engineering teams and driving innovation in Over-The-Air and antenna measurements, EMC, and vector network analysis.

Eager to be part of the rapidly growing field of AI and data center technology, he took on a new challenge in 2025 as Senior Director of R&D for Compute, Storage, Optical Transport and High-Speed Ethernet Test Solutions at VIAVI Solutions in Eningen, Germany. Benoit is an Edmond S. Gillepsie Fellow of the Antenna Measurement Techniques Association (AMTA) and a Distinguished Lecturer of the IEEE EMC Society (2024–2025). He has authored more than 100 scientific publications and holds over 45 patents, with his research centered on antenna systems and near- and far-field characterization techniques.

COMSOL
Andrew Strikwerda, Lead Application Engineer
Technical Talk - 10am PT / 1pm ET: Signal Integrity Simulation with COMSOL Multiphysics: From S-Parameters to Real-World PCB Behavior
Andrew Strikwerda is a lead application engineer at COMSOL specializing in electromagnetics. He received his PhD in physics from Boston University and conducted postgraduate research at the Technical University of Denmark. He was a senior staff scientist at the Johns Hopkins University (JHU) Applied Physics Laboratory and taught in the JHU Whiting School of Engineering.

Keysight
Hee-Soo Lee, High-Speed Digital Segment Lead
Technical Talk - 10:30am PT / 1:30pm ET: Rising Speeds, Denser Packaging, Tighter Margins: Our Path Forward
Hee-Soo Lee is the High-Speed Digital Segment Lead for EDA Software of Keysight Design Engineering Software division, located in Santa Rosa, California, USA. He has held several positions in Keysight, Agilent Technologies, and Hewlett-Packard, including consulting business manager, technical marketing lead, and field applications engineer since 1989. Before, he worked for Daeryung Ind. Inc. as an RF/MW circuit design engineer. He has over 35 years of design and simulation experience in RF, microwave, and high-speed digital designs. He graduated with a BSEE from Hankuk Aviation University, South Korea.


Altium
Alexsander Tamari, Technical Marketing Engineer
Technical Talk - 11am PT / 2pm ET: Bringing Signal and Power Integrity Analysis Earlier into the PCB Design Workflow
Alexsander joined Altium as a Technical Marketing Engineer and brings years of engineering expertise to the team. His passion for electronics design combined with his practical business experience provides a unique perspective to the marketing team at Altium. Alexsander graduated from one of the top 20 universities in the world at UCSD where he earned a Bachelor’s degree in Electrical Engineering.

Teledyne LeCroy
Dr. Patrick Connally, Product Architect
Technical Talk - 11:30am PT / 2:30pm ET: How to Make Precise High-speed Oscilloscope Measurements
Dr. Patrick Connally has worked at Teledyne LeCroy’s oscilloscope division since 2013, where he is currently a product architect. His work involves product definition for high-bandwidth oscilloscopes, and signal analysis methodologies for high-speed serial communications applications. He received his PhD from Queen’s University Belfast in 2006.

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