Signal Integrity Journal Webinar Series

Title: Mitigating Crosstalk for 16Gb/s UCIe Chiplet

Date: March 20, 2025

Time: 8am PT / 11am ET

Sponsored by: Keysight

Presented by: Benjamin Dannan, Chief Technologist, Signal Edge Solutions and Hee-Soo Lee, High-Speed Digital Segment Lead for EDA Software of Keysight Design Engineering Software

Abstract:
Multi-die packaging with chiplets is crucial for high-performance data centers and aerospace and defense solutions, demanding advanced packaging technologies. The UCIe Consortium's 2.0 specification promises significant bandwidth, density, and power efficiency advancements. Modern chiplet designs feature hundreds of single-ended signals operating at 16 Gb/s, with 32 Gb/s on the horizon. Accurate modeling of these dense interconnects is critical for reliable package substrate design. This presentation demonstrates a workflow for analyzing and mitigating crosstalk in a 16 Gb/s UCIe die-to-die interface that employ a single macro to represent the interface and analyze crosstalk effects from multiple single-ended nets within the same macro. By identifying the worst-case aggressor, we strategically incorporate additional return vias to enhance signal integrity and improve eye diagram quality. This workflow provides a robust approach for the sign-off of advanced package designs for demanding chiplet applications.

Presenter Bios:
HeeSoo Lee is the High-Speed Digital Segment Lead for EDA Software of Keysight Design Engineering Software division, located in Santa Rosa, California, USA. He has held several positions in Keysight, Agilent Technologies, and Hewlett-Packard, including consulting business manager, technical marketing lead, and field applications engineer since 1989. Before, he worked for Daeryung Ind. Inc. as an RF/MW circuit design engineer. He has over 30 years of design and simulation experience in RF, microwave, and high-speed digital designs. He graduated with a BSEE from Hankuk Aviation University, South Korea.

Benjamin Dannan is the Chief Technologist at Signal Edge Solutions, a senior member of IEEE, and an experienced signal and power integrity (SI/PI) design consultant, advancing high-performance ASICs and developing advanced packaging solutions for high-speed digital designs. He is a Keysight Certified Expert in ADS and holds a certification in cybersecurity. He has a BSEE from Purdue University, a Master of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq, totaling 47 combat missions, and a trained USAF Cyber Operations Officer. In addition, he has co-authored multiple peer-reviewed journal publications on SI/PI-related topics and has twice received the prestigious DesignCon Best Paper award.

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