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The Limitations of RS FEC-Based Protocols in Automotive Error Handling


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12/5/23 11:00 am to 12:00 pm EDT

Event Description

Signal Integrity Journal Webinar Series

Title: The Limitations of RS FEC-Based Protocols in Automotive Error Handling

Date: December 5, 2023

Time: 8am PT / 11am ET

Sponsored by: Valens

Presented by: Eyran Lida, CTO, Edo Cohen, VP Product and Daniel Shwartzberg Director of Business Development and System Solutions, Valens

This webinar will dive into the intricate world of automotive data protocols, where the proliferation of sensors is increasing data rates. We will profile the characteristics of various noise types and shed light on the challenges they pose to legacy error handling mechanisms. We will examine how Forward Error Correction (FEC) falls short in addressing the Narrow Band Interference (NBI) which is the most dominant noise profile present in the automotive environment and how this limitation is wearing away the RS-FEC advantages in addressing broadband noises like AWGN and XTalk. By analyzing worst-case channel signal-to-noise ratios, we will show that RS-FEC based protocols are limited in meeting today and tomorrow's bandwidth demands.

Join Valens’ CTO Eyran Lida and VP Product Edo Cohen, as they unveil the groundbreaking A-PHY technology, and how it resiliently tackles all automotive noise types. Findings will be presented using results from certified testing facilities and labs, such as Huber Automotive and Denso EMCES, demonstrating how A-PHY overcomes harsh EMI environments and provides error-free links to address increasing data rates.

Presenter Bios:
Eyran is the Co-founder and CTO of Valens Semiconductor. The lead inventor of HDBaseT technology, Eyran is responsible for technology, strategy development and for the company’s patent portfolio. Eyran’s background includes over 30 years of communication systems software and hardware architecture development experience, with primary expertise in wireline hardwired DSP modem design. He holds 75 US patents, and he is one of the leading technical contributors for MIPI’s Automotive PHY (A-PHY) specifications.

Edo Cohen is the Vice President of Product at Valens, where he leads the company's strategic innovation initiatives. With over 30 years of experience, Edo brings extensive knowledge in system architecture, technical specifications, definition, and execution. Prior to Valens, he was a Senior System Architect, at Intel Corporation, heading activities of the Wearables and IOT. Previously, Edo was a Senior Staff System Engineer at Marvell Cellular Division, responsible for the company’s cellular processor environment, and held engineering managerial positions at NAMS, Floware, and Alvarion. Edo leads standardization initiatives, currently serving as the Co-Chair of the A-PHY Working Group and a member of the MIPI Alliance. Edo holds an MBA and a B.Sc. in Electrical Engineering from Tel Aviv University.

As Director of Business Development and System Solutions at Valens Semiconductor, Daniel brings more than 30 years of engineering experience to this role, working with OEMs and Tier-1s worldwide to bring innovative next-gen E/E architectures and solutions to market. Prior to Valens, Daniel was Director of Marketing at TranSwitch, and has also held positions in project management and engineering at Mindspeed Technologies, Comverse Network Systems and Ford Motor Company. Daniel holds a Master’s degree in Engineering and a Bachelor’s Degree with Honors in Electrical and Electronic Engineering from the University of Hertfordshire, United Kingdom.

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