EDI CON Online
Title: Building and Using Numerical and Analytical Models in PCB Interconnect Optimization
Date: August 11, 2021
Time: 10:00am PT / 1:00pm ET
Presented by: Zachariah Peterson, Owner, Northwest Engineering Solutions
PCB optimization focuses on designing boards to meet specific performance metrics while satisfying specific design constraints. In particular, interconnect design requires satisfying multiple design objectives and constraints that may be in conflict, and engineers need tools and methods to help them balance design these objectives while staying within their design constraints. For ultra-high-speed boards, designers need to optimize transmission line designs within the relevant signal bandwidth, which can extend to hundreds of GHz. Newer signaling specifications and standards (e.g., USB4, DDR5, and IEEE 802.3 standards) require this type of optimization. In this presentation, the use of model extraction, design exploration, and fusion of analytical/numerical models will be presented with the goal of developing models for broadband design optimization. For PCB transmission lines, a model that accounts for copper roughness and dispersion with numerical or analytical impedance models will be presented. These concepts fit within recent research on novel CAD and field solver methodologies to address high speed/high frequency interconnect design challenges.
Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and technical content marketing services to electronics companies and ECAD vendors. His background in research spans topics in lasers, electronic and optoelectronic semiconductor devices, environmental sensing systems, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written hundreds of technical articles on PCB design for ECAD vendors and PCB manufacturers. Zachariah currently works with other companies in the electronics industry providing design, research, and marketing services. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, and the American Physical Society, and he currently serves on the INCITS Quantum Computing Technical Advisory Committee.
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