Articles by Infineon Technologies AG

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. 

Infineon Technologies AG announced a collaboration with d-Matrix^®, a pioneer in highly interactive, low-latency AI inference compute for data centers.

Infineon Technologies AG expands its CoolGaN™ portfolio with the CoolGaN Drive HB 600 V G5 product family.

Infineon Technologies, a global leader in power semiconductors and IoT, has published the 2026 edition of its annual GaN Insights, providing valuable awareness into the world of GaN technology, its applications, and future prospects.  

Infineon has announced that CoolSiC™ MOSFETs have been adopted in the new bZ4X model from Toyota, the world's largest automaker.

Infineon introduces the EZ-USB™ FX2G3, a next-generation USB 2.0 peripheral controller designed to deliver superior performance, robust security, and advanced power efficiency for USB devices.  

Infineon has announced that AMD has tested its 64 Mb HYPERRAM memory and HYPERRAM controller IP for use with the AMD Spartan UltraScale+ FPGA SCU35 Evaluation Kit, enabling the AMD MicroBlaze V soft-core RISC-V processor with cost-effective, high-bandwidth memory.

The collaboration focuses on the joint design, optimization, and validation of a modular 2-5 megawatt SST building block.

The IPOSIM from Infineon Technologies AG is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.

Designed for point of load power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems.