Articles by Infineon Technologies AG

Infineon Technologies AG announced the XENSIV™ Sensor Shield for Arduino, a versatile tool designed for evaluating smart sensor systems in smart home and diverse consumer applications.

Infineon Technologies AG introduces the new CoolSiC MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability, even under demanding high voltage and switching frequency conditions.

Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of SiC MOSFET trench technology

Infineon Technologies AG introduces the 750V G1 discrete CoolSiC MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.

Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality, and total cost of ownership for AI data centers.

Infineon Technologies AG detailed its plans to highlight the industry’s broadest range of power electronic devices during the 2024 Applied Power Electronics Conference (APEC), February 25-29.

Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density. Enabled by Infineon’s GaN transistors, the power converters will be lighter and smaller in size with reduced system costs.

Infineon Technologies AG has announced its partnership with OMRON Social Solutions Co. Ltd., a pioneering company in social systems technology. 

The EZ-USB FX10 offers fast connectivity with USB 10 Gbps and LVDS interfaces, increasing the total bandwidth up to three times compared to its predecessor.

Infineon Technologies LLC Memory Solutions has announced the availability of its latest radiation-hardened asynchronous static RAMs designed with Infineon’s patented RADSTOP™ technology.