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In today’s ever-changing PCB requirements arena, DC drop caused by IR losses are becoming a bigger concern for design engineers. Along with the IC currents demands increasing the currents carried on the PCB are rising as the voltages, and voltage margins, decrease. As the currents increase so do the heating effects of IR drop and their consequences to the PCB design. SIwave introduces a new solver type for design engineers to investigate preliminary thermal performance on designs.

Crosstalk, or coupling, in high speed printed circuit board and packages represent one of main signal integrity design challenges. The cost of failure is very high and requires careful design strategies. This application note will introduce the capabilities for SIwave to automatically, and quickly, scan the entire PCB or package layout and report Near and Far End crosstalk coefficients.

In order to accurately compute the response from high speed packages and printed circuit boards, it is essential that they are modeled comprehensively in simulation tools. This application note will introduce the capabilities for SIwave to model conformal solder mask layers in the stackup.

Power Delivery Network(PDN) time domain noise analysis is an essential part for SI/PI/EMI analysis, SIwave can utilize CPM’s current PWL file as a current sink for transient analysis combed with C4 bump’s RLC parasitics to give more realistic and accurate noise value.

This paper will present correlation data to validate the software and hardware tools necessary for fast-track deployment in upcoming PAM-4 applications.

A quick overview of how to download and use Signal Integrity Design Using Keysight Advanced Design System (ADS) including examples.

Keysight ADS 2016 features a host of new, technologies designed to improve productivity, including two electromagnetic (EM) software solutions specifically created to help signal and power integrity engineers improve high-speed link performance in PCB designs. What follows is a listing of 8 ways in which ADS 2016 can help you, the engineer, overcome your signal and power integrity challenges.

In the beginning there was transient simulation. Ensuring functional chip-to-chip links in a system meant performing a time-domain simulation with a SPICE simulator. The result was a time-domain waveform that was evaluated during post processing for signal integrity (SI). The main task was to measure the eye diagram, usually assuming a perfect clock as the phase reference. Due to rising signaling speeds and decreasing timing margins, the task was made more challenging when it became necessary to account for other effects.