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Infineon's new CoolSiC JFET devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal for advanced solid-state protection and distribution.
Astera Labs, Inc. announced that its purpose-built PCIe 6 connectivity portfolio is ramping production to fast-track deployments of modern AI platforms at scale.
The EEcosystem's new online learning platform debuts with Transmission Lines 101, a free course created in partnership with world-renowned signal integrity expert Professor Dr. Eric Bogatin.
IDTechEx's recent report examines how CPO technology can enhance data center efficiency and shape infrastructure to allow for more powerful computing systems, and predicts the total CPO revenue to reach $1.2 billion by 2035, growing at a CAGR of 30% from 2025.
IDTechEx's new report, "Emerging Memory and Storage Technology 2025-2035: Markets, Trends, Forecasts", provides an in-depth analysis of the evolving storage landscape and its impact on cost, efficiency, and scalability.
The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.
Rohde & Schwarz will showcase its latest solutions and advanced techniques for testing and analyzing power electronic systems and components at PCIM Expo 2025 in Nuremberg, Germany.
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