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Samtec Inc., will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.

imec, demonstrates a field-free switching operation of spin-orbit torque MRAM (SOT-MRAM) devices – eliminating the need for an external magnetic field during write operation. The concept is manufacturing-friendly and does not compromise the reliability and sub-ns writing performance of the SOT-MRAM devices.

KEMET Corporation expanded the temperature capability of T598 devices, a Tantalum Polymer Surface Mount Capacitor. These devices address the stringent requirements and new challenges presented by megatrend applications in automotive Advanced Driver Assistance Systems (ADAS), autonomous driving and in digitalization uses such as supercomputing, mobility services, connectivity and infotainment.

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop  power semiconductors with more power density and energy efficiency. Power semiconductors are needed in all stages of energy conversion: generation, transmission, and use. More efficient semiconductors make a major contribution towards reducing carbon dioxide emissions in spite of the world's growing energy needs. Universities, research institutes, small and medium-sized companies and international corporations are involved in this cooperation. Infineon Technologies Dresden GmbH & Co. KG is coordinating this project.

Teledyne LeCroy introduced its WavePulser 40iX high-speed interconnect analyzer, a capable solution for complete interconnect testing and validation.

Tektronix introduced two new oscilloscopes to its portfolio: the 3 Series MDO mixed domain oscilloscopes and 4 Series MSO mixed signal oscilloscopes. The new products feature touchscreen user interfaces, the largest and highest resolution displays in their classes and sleek designs for cramped lab benches.

Fiber optic connectors are the ideal place to start meeting the need for higher density as we move to accommodate the high density optical interconnectivity demands of hyperscale data centers and edge computing – that’s the view of David Aspray, European Sales Manager for SENKO Advanced Components.

A new form of magnetic interaction which pushes a formerly two-dimensional phenomenon into the third dimension could open up a host of exciting new possibilities for data storage and advanced computing, scientists say.  In a new paper published in the journal Nature Materials, a team led by physicists from the University of Glasgow describe how they have been found a new way to successfully pass information from a series of tiny magnets arrayed on a thin film across to magnets on a second film below.

Analog Bits and GLOBALFOUNDRIES announced the availability of Analog Bits analog and mixed signal IP design kits for GF’s 12nm Performance (12LP) process technology.