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Visitors to the EMV 2019 in Stuttgart from 19 to 21 March 2019 can look forward to a series of highlights: international exhibitors, a multi-faceted forum program, career opportunities and practice-oriented workshops.

ZTE Corporation, introduced the first 5G fronthaul 200G outdoor OTN product, the ZXMP M721 OD62. Featuring small size and high reliability, the ZXMP M721 OD62 is designed to be easy to install and maintain, and it can be applied to the metro edge layer.

Rohde & Schwarz provides an automotive Ethernet testing solution to the University of New Hampshire InterOperability Laboratory (UNH-IOL). From now on, OEMs, Tier1s, Tier2s, and System Integrators can submit their products for compliance test certification via UNH-IOL, the first OPEN Alliance accredited test lab providing test certification for automotive Ethernet.

GL Communications Inc. announced its insight into the High Speed OC3/12 and STM1/4 Analysis and Emulation Platform referred to as LightSpeed1000.

USB Type-C Development Kit from Würth Elektronik eiSos is designed for those looking to take advantage of the vastly expanded range of options offered by USB Type-C and USB power delivery.

Efficient Power Conversion (EPC) is joining forces with Yole Développement (Yole) and SEMI to sponsor the first ever ‘GaN Con,’ a networking event covering the entire power GaN industry from manufacturers to end users.

Keysight Technologies, Inc. introduced the BenchVue Lab Management and Control solution, a software tool designed to simplify the configuration, monitoring and tracking of lab instruments while optimizing student learning.

Electronic Products, Inc. (EPI), a full-service, “powder-to-package” electronic device packaging designer and manufacturer, has announced increased capability to resolve various optoelectronic package challenges at Photonics West.

Pasternack has launched a new extended series of mmWave, removable,  edge launch, PCB connectors that are ideal for SERDES applications like high-speed networking, cloud servers and supercomputing. 

ANSYS Cloud aims to help businesses of all sizes to accelerate innovation and reduce time to market with the power of on-demand simulation and high-performance computing (HPC). ANSYS Cloud is designed to help engineers obtain high-fidelity simulation results and evaluate more design variations in less time and with a smaller information technology footprint.