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GLOBALFOUNDRIES and SiFive, Inc. announced that they are working to extend high DRAM performance levels with high bandwidth memory (HBM2E) on GF’s recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for artificial intelligence (AI) applications.

Stewart Connector, expands the SealJack PCB Mount Series with a right-angle SealJack connector, which supports connectivity for Internet of Things (IoT) devices.

New Yorker Electronics has added the Amphenol RF 12G MCX connectors to its lineup of 12G Optimized Amphenol RF Connectors. Designed specifically for 4K/Ultra-HD broadcast applications, they are used in 4K/8K video cameras, mobile broadcasting, digital signage and other video applications. These new PCB connectors and cable connectors boast standard 12Gbps performance per SMPTE.

GaN Systems announced the availability of a high-speed, half-bridge GaN daughter board using GaN Systems’ 650 V, 30 A GaN E-HEMTs and ON Semiconductor’s NCP51820 high-speed gate-driver evaluation board.

EDI CON Online, an interactive event held for the first time September 10-12, 2019, has posted impressive results for its inaugural year with more than 4400 sessions attended to date. 97% of attendees surveyed noted they would attend another EDI CON Online, and 97% would also recommend the event to a colleague.

The independent technology group Rohde & Schwarz closed its 2018/2019 fiscal year (July to June) with strong results. At EUR 2.14 billion, revenue was 4.9 percent higher than in the previous year, while incoming orders rose by 10.6 percent to EUR 2.45 billion.

Researchers in UC Santa Barbara/Google scientist John Martinis’ group have made good on their claim to quantum supremacy. Using 53 entangled quantum bits (“qubits”), their Sycamore computer has taken on and solved a problem considered intractable for classical computers.

Keysight Technologies, Inc., has extended the company's N9048B PXE Electromagnetic Interference (EMI) Receiver from 26.5 to 44 GHz enabling customers to meet current and emerging compliance testing requirements according to various standards bodies, including MIL-STD-461G and FCC Part 15.

Alliance Memory announced that it has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.

IEEE announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements and potential solutions.