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Yole Group’s new report, Glass Materials for Advanced Packaging 2025, provides the first in-depth analysis dedicated to the fast-growing glass materials market across multiple packaging platforms.
Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency.
Data communications has quickly become the "killer app" for PICs. PIC transceivers are fast becoming ubiquitous in data centers, where they increase the throughput of connections between nodes whilst reducing the physical size of transceivers, solving space issues for data center operators.
IDTechEx's report, "Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts", critically assesses the key developments and trends in memory and storage technologies.
The grip of AI has continued to hold, with strong competition to develop more powerful AI models, active innovation in the semiconductor industry, and continued investment in the HPC data center market.
IDTechEx's latest report provides data to show that the use of GPUs within HPC has been increasingly adopted since the introduction of generative AI and large language models, as well as advanced memory, storage, networking, and cooling technologies.
A new report from IDTechEx predicts that the growing use-cases of AI and machine learning and scale of the largest AI models will drive significant growth in this already-large market.
Delta will debut at SC24 with its broad spectrum of energy-efficient power, thermal management, and infrastructure solutions for AI and HPC data centers.
