We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.
In contrast to other GaN products on the market, the input and output figures-of-merit of these transistors provide a 20% better performance, resulting in increased efficiency, reduced power losses, and more cost-effective solutions.
Infineon announces two new generations of high voltage and medium voltage CoolGaN TM devices, which now enable customers to use GaN in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalization and decarbonization.
Infineon Technologies AG introduces the new CoolSiC MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability, even under demanding high voltage and switching frequency conditions.