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EDI CON Online: Ground Stitching and Copper Balancing for High Performance Si Evaluation Kits

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When

8/11/21 11:00 am to 8/11/21 11:30 am EDT

Event Description

EDI CON Online

Title: Ground Stitching and Copper Balancing for High Performance Si Evaluation Kits

Date: August 11, 2021

Time: 8:00am PT / 11:00am ET

Sponsored by: Samtec, Inc.

Presented by: Ted Ballou, Sr. SI Engineer, Samtec, Inc.

Abstract:
High-performance I/O interfaces offer small design margin for physical channel impairments such as routing impedance discontinuities and crosstalk. Mitigation techniques commonly deployed in single-purpose test/evaluation boards include thieving pads (copper balance and etch control) and stitching vias (crosstalk reduction and optimal return path). For critical high-speed nets, best practices combine these as “stitched thieving” in a parade-route configuration along the routing net. This approach is not trivial, and it becomes more challenging as designs complexity increases such as in multi-layer PCBs with BGA breakouts. In this workshop, Ted Ballou details strategies for managing layout challenges and addressing practical design constraints. Additionally, he will provide an apples-to-apples comparison of measured results with “before” and “after” PCB design iterations.

Presenter Bio:

Ted Ballou is a Sr. SI Engineer at Samtec. He helps develop high speed PCB designs for testing and showcase Samtec high-performance interconnects for bleeding edge 56 Gbps PAM4 and 128G PAM4 data rates. Ted received his BSEE from the University of South Carolina.

Please note:
To register for other EDI CON Online RF and microwave related events, please visit the Microwave Journal website.

By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, Signal Integrity Journal™, the speakers & the sponsors of this event. You may be contacted regarding the subject matter presented.

 

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