High Speed Digital 3D EM Forum
Date: May 26, 2021
Time: 1:00 pm – 5:00 pm ET
Don’t miss this half-day online High Speed Digital 3D EM Forum featuring industry leaders covering key design topics for High Speed Design engineers.
KEYNOTE: Interconnect Modeling and Its Importance to HSSD Simulation
Presenter: Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SIJ, and Teledyne LeCroy Fellow
Folding and Simulating a Rigid-Flex PCB: It is Easier than You Might Think
Presenter: Yuchu He, Hardware Engineer, Google
Signal Integrity and Power Integrity Optimization Work Flow for Display Sub-System in Mixed-Reality Products Using 3D EM Simulation
Presenter: Dr. Yu, Director of Electrical Engineering, Product Design Engineering Group, Mixed-Reality Team, Microsoft
3D FEM Solver Scalability: Ready to Go Big?
Presenter: Yash Padooru, Principal Product Engineer, Cadence
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