High Speed Digital 3D EM Forum

Date: May 26, 2021

Time: 1:00 pm – 5:00 pm ET

Abstract:
Don’t miss this half-day online High Speed Digital 3D EM Forum featuring industry leaders covering key design topics for High Speed Design engineers.

KEYNOTE: Interconnect Modeling and Its Importance to HSSD Simulation
1pm ET
Presenter: Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SIJ, and Teledyne LeCroy Fellow

Folding and Simulating a Rigid-Flex PCB: It is Easier than You Might Think 
2pm ET
Presenter: Yuchu He, Hardware Engineer, Google

Signal Integrity and Power Integrity Optimization Work Flow for Display Sub-System in Mixed-Reality Products Using 3D EM Simulation
3pm ET
Presenter: Dr. Yu, Director of Electrical Engineering, Product Design Engineering Group, Mixed-Reality Team, Microsoft

3D FEM Solver Scalability: Ready to Go Big?
4pm ET
Presenter: Yash Padooru, Principal Product Engineer, Cadence

Please note:
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