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EDI CON Online: PC Board and Interconnect Design for Low EMI

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When

10/13/20 1:00 pm to 10/13/20 1:30 pm EST

Event Description

EDI CON Online

Title: PC Board and Interconnect Design for Low EMI

Date: October 13, 2020

Time: 10:00am PT / 1:00pm ET

Presented by: Ken Wyatt, Principal Consultant, Wyatt Technical Services LLC

Abstract:
As a consultant for over 10 years, I’ve realized the root cause of many design issues revolves around the circuit board design and how the I/O and power connectors are arranged and filtered. Poor board designs and poor interconnect placement and filtering can result in radiated emissions, radiated immunity, and electrostatic discharge (ESD) compliance failures, among others. Bad designs often result in endless cycles of trial and error mitigation, compliance testing and board spins. This drags out the schedule and is very costly. In the presentation, I’ll explain how digital signals propagate in boards as electromagnetic fields. I’ll also explain how interconnect placement and poor filtering design and layout can affect the EMI performance. Once you understand this, then board stack-up, trace routing, filter design and interconnect placement should become very clear and you should be able to design a low-EMI board the first time!

Presenter Bio:

Ken Wyatt is principal consultant of Wyatt Technical Services LLC, as well as past senior technical editor for Interference Technology Magazine (2016 to 2018). He is based in Colorado and has worked in the field of EMC engineering for over 30 years with a specialty is EMI troubleshooting and pre-compliance testing. He trains and speaks internationally, is widely published, and is the co-author of the popular EMI Troubleshooting Cookbook for Product Designers. He may be contacted through his web site, http://www.emc-seminars.com.

Please note:
To register for other EDI CON Online signal integrity, power integrity and EMC/EMI related events, please visit the Microwave Journal website.

By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, Signal Integrity Journal™, the speakers & the sponsors of this event. You may be contacted regarding the subject matter presented.

 

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