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EDI CON Online OCTOBER 13 KEYNOTE: Stretching the Limits of PCB Design

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When

10/13/20 10:00 am to 10/13/20 10:30 am EST

Event Description

EDI CON Online

Title: OCTOBER 13 KEYNOTE: Stretching the Limits of PCB Design

Date: October 13, 2020

Time: 7am PT / 10am ET

Sponsored by: Microwave Journal & Signal Integrity Journal

Presented by: Janine Love, Editor, Signal Integrity Journal; Pat Hindle, Editor, Microwave Journal; Gary Lerude, Technical Editor, Microwave Journal

Abstract:
Expanding markets, such as automotive, IoT, wearables, and healthcare, continue to drive innovation in printed circuit board and interconnect design. While new materials and technologies are being stretched to their limits, some fascinating new design and manufacturing methods are offering completely new ways to create PCBs, eliminating some of the old trade offs and revealing new ones. In this keynote, the editors of Microwave Journal and Signal Integrity Journal take a closer look at some of the market drivers, creative new products, and new ways of manufacturing PCBs. The keynote includes interviews with leaders from two companies developing new capabilities: Dr. Jaim Nulman, Nano Dimension CTO, discussing 3D printed PCBs and Philip Johnston, CEO of Trackwise Designs plc. discussing infinitely long, flexible PCBs. Join us in this keynote for a fascinating and engaging journey into what’s possible.

Presenter Bios:

Janine Sullivan Love has a strong interest in science and technology, was trained as an educator, and began working as a professional writer more than 20 years ago. She currently serves as the editor of Signal Integrity Journal, Technical Program Director for EDI CON, and Exhibition Operations Manager for IMS at Horizon House Publications, Inc. She is also a contributing editor to Microwave Journal.

Pat Hindle is editor at Microwave Journal and responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Gary Lerude serves as Technical Editor of Microwave Journal. Previously, he was at TriQuint Semiconductor, where he held business development, strategic marketing, and product marketing management roles for TriQuint’s infrastructure products. Gary had similar roles at M/A-COM, where he covered both commercial and defense markets. He started his microwave career at Texas Instruments, where he was one of the “midwives” at the birth of GaAs MMIC technology. Gary holds a bachelor’s in EE, master’s in systems engineering, and an engineer’s degree in EE.

Please note:
To register for other EDI CON Online signal integrity, power integrity and EMC/EMI related events, please visit the Microwave Journal website.

By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, Signal Integrity Journal™, the speakers & the sponsors of this event. You may be contacted regarding the subject matter presented.

 

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