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Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics (IME) and Soitec (Euronext Paris), announce the launch of a joint program to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.

MathWorks introduced the Release 2019a of MATLAB and Simulink. The release contains new products and important enhancements for artificial intelligence (AI), signal processing, and static analysis, along with new capabilities and bug fixes across all product families.

Saelig Company, Inc. introduced the PicoScope 9404-05 5GHz oscilloscope, a PC based high-resolution device which brings affordable high-speed performance by combining the benefits of real time and equivalent time sampling with very high analog bandwidth. The PicoScope 9404-05 has four 5GHz 50 ohm input channels, each with its own advanced 12-bit ADC, which provide the required timing and display resolution for accurately measuring and visualizing high-speed repetitive analog and data signals.

The EMV in Stuttgart once again proved itself to be a significant platform for the field of electromagnetic compatibility. The event, which took place from 19 – 21 March 2019, showcased a broad spectrum of product and services at the exhibition, and presented current expert knowledge in the workshops.

Infineon Technologies AG extends its portfolio of high current system chipset solutions with the first 16-phase digital PWM multiphase controller, enabling currents of 500 to 1000 A for next generation CPUs, GPUs, FPGA and ASICs used in artificial intelligence (AI) servers and 5G datacom applications.

Infineon Technologies AG introduces the newest member of its integrated point-of-load product family, the IR38164 DC-DC POL converter. Infineon's IR38x6x family offers either full SVID compatibility or 3-bit PVID flexibility.

Samtec announces the release of mPOWER connectors – the micro high-power solution with design flexibility for power-only or power/signal applications.

Silicon Labs has introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed to provide accurate current and voltage measurement with very low drift across temperature.

TE Connectivity (TE) is introducing a new series of Ethernet jacks with integrated magnetics and Power over Ethernet (PoE) specifically designed for industrial applications which help to simplify PCB design efforts and simplify peripheral powering in the total system.

EDI CON China 2019 taking place April 1-3, 2019 at the China National Convention Center in Beijing has announced the finalists in the second annual EDI CON China Product Innovation Awards.