Buyer's Guide

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3U 12-slot backplane aligns with The Open Group Sensor Open Systems Architecture™ (SOSA) Technical Standard 1.0. The backplane is an update to Elma’s original CMOSS reference backplane supporting the U.S. Army’s latest open standards requirements. The 3U OpenVPX backplane offers a mix of plug-in card slots that enable complex, high speed signal processing and system development, supporting up to 100 Gigabit Ethernet.

Flex Power Modules has expanded its range of 2” x 1” encapsulated, through-hole DC/DC converters with the addition of three of the latest parts with single outputs of 24 V (21.6-26.4 V), 48 V (43.2-52.8 V) and 54 V (48.6-59.4 V). The parts retain the wide 8:1 input range of the PKE8000A series, suiting nominal inputs of 12 V, 24 V, 28 V or 48 V for a wide range of industrial, transportation, RFPA, and IT applications.

NXP® Semiconductors has launched the S32G GoldVIP to help address real-time and application development challenges of software-defined vehicles using S32G vehicle network processors. This groundbreaking vehicle integration platform offers multiple value propositions for S32G processor evaluation, software development, and rapid prototyping efforts.

The EiceDRIVER F3 Enhanced is housed in a 300 mil wide-body DSO 16 package with a large creepage distance of 8 mm. The single-channel isolated gate driver offers an exceptional high common-mode transient immunity (CMTI) of up to 300 kV/us and typical output currents of up to 8.5 A.

 The VPX703 is a 3U VPX module based on the Freescale QorIQ T4241 or T4161 with dual GbE and PCI x8 to the backplane. The module provides 64 GB of on-board flash and up to 12 GB DDR3.

PCIe 6.0 is an important and scalable standard for data-intensive markets such as data center, artificial intelligence/machine learning (AI/ML), and high-performance computing. 

Release of LightCONEX® optical plug-in and backplane module connectors compatible with the VITA 66.5 draft standard and aligned with the SOSA™ Technical Standard for VPX systems in rugged embedded computing applications and sensor systems.

Ceramic core chip inductor series for power applications – SMP0603. This power series is ideal for use in test & measurement, industrial control, and automotive sectors. These high performance chip inductors can also be utilized in RF applications in commercial, medical, and military markets.

Availability of the DFE21CCN series, latest power inductors developed for the 5G smartphone market. Comprised of four inductance values, the line is intended for use in DC/DC converter and power management circuitry.