We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Yole Group publishes its new report, "Data Center Semiconductor Trends 2025," offering an in-depth analysis of how AI, HPC, and hyperscaler demand are driving a new semiconductor paradigm.
HUBER+SUHNER opened its new advanced manufacturing site in Pisary, Poland, dedicated to the large-scale production of POLATIS® optical circuit switches for AI and hyperscale data centers.
IDTechEx's recent report examines how CPO technology can enhance data center efficiency and shape infrastructure to allow for more powerful computing systems, and predicts the total CPO revenue to reach $1.2 billion by 2035, growing at a CAGR of 30% from 2025.
The three companies will develop technologies for broadband optical SSDs to enhance their suitability for advanced applications that require high-speed transfer of large data, such as generative AI, and will also apply them to proof-of-concept tests for future social implementation.
Designed to deliver the highest optical measurement sensitivity and integrated clock recovery up to 120 GBaud, the instruments specifically target the rigorous demands of 1.6 T transceiver optical testing for R&D and manufacturing of next-generation optical interconnects for data centres AI clusters.
The comprehensive BBU roadmap includes power solutions from 4 kW up to the world’s first 12 kW battery backup unit. The BBU solutions are designed to deliver highly efficient, reliable, and scalable power conversion in AI server racks.
Through enhanced system performance and with Infineon’s trademark robustness, the new OptiMOS TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership for AI data centers operators.
With ongoing advancements in technology, regional adoption trends, and a focus on green computing, the data center immersion cooling market is set to become a cornerstone of the next-generation digital infrastructure.
SiTime announces the differential-ended SiT5977 Super-TCXO, the only single-chip timing solution that delivers the most resilient performance for AI compute-nodes with high bandwidth and network synchronization.
