The 2019 IEEE International Symposium on EMC and Signal/Power Integrity (EMC+SIPI) was held in New Orleans for the first time in our 50+ year EMC Society history taking place July 22-26. Read this review of the event.

In case you could not make it to EDI CON USA or just want a quick review of the event, here is summary of the keynotes, conference sessions and product review.

SIJ talked with Roger Tushingham about how to foster innovation and next-generation circuit materials needs.