Special Report

High Bandwidth Connectors: Sorting Out What Matters

jlove@signalintegrityjournal.com — Tue, 19 Apr 2022 00:00:00 -0400

Exceeding the speed limit is the theme of this issue of Signal Integrity Journal (SIJ), and nowhere is speed more of a design concern than for connectors. As connectors get smaller and denser while handling faster speeds, there is a significant chance that signal interference and crosstalk will increase. The following is a compilation of everyone’s thoughts on what’s new, what’s real, and what we should be worried about.

Executive Interview: Rob Russell, VP of Satellite Business Unit at Vicor

Thu, 31 Mar 2022 00:00:00 -0400

Rob Russell, VP of Satellite Business Unit at Vicor, discusses the challenges for power in the LEO and MEO satellite market and how those issues are being addressed with new architectures.

A Gift for SIJ Readers

Tue, 21 Dec 2021 00:00:00 -0500

As a closing gesture to the SI, PI, and EMC/EMI community, we want to leave all of you with a year-end holiday gift for your continued support.

Executive Interview: Timothy Vang, Semtech

jlove@signalintegrityjournal.com — Tue, 14 Sep 2021 00:00:00 -0400

SIJ recently caught up with Timothy Vang, vice president of marketing and applications for Semtech’s Signal Integrity Products Group about the company’s latest product for 50Gbps PAM4 5G front haul deployments, how signal integrity and RF/wireless design overlap, and what is next for the team at Semtech.

Home Labs of the Stars

jlove@signalintegrityjournal.com — Wed, 10 Mar 2021 00:00:00 -0500

While many already had home lab setups for projects and exploring curiosities, the challenges of the global pandemic have driven many to ramp up their set ups and spend more time at their in-house benches. Over the years, Signal Integrity Journal has worked with many leading industry experts and stars in our field. Some have gamely agreed to play along with me and share images of their home labs. Enjoy the tour!

PC Board Design for Low EMI in IoT Products

ken@emc-seminars.com — Thu, 23 Jul 2020 00:00:00 -0400

Most of today’s digital-based products create a large amount of on-board RF harmonic “noise” (EMI). While this digital switching won’t usually bother the digital circuitry itself, that same harmonic energy from digital clocks, high-speed data buses, and especially on-board DC-DC switch-mode power supplies can easily create harmonic interference well into the 600 to 850 MHz cellular phone bands and even as high as 1575 MHz GPS/GNSS bands, causing receiver “desense” (reduced receiver sensitivity).

Coronavirus Shows How Quickly Electronics Supply Chains Can Change

zmpeterson86@gmail.com — Fri, 27 Mar 2020 00:00:00 -0400

In an analysis of supply chain data and IPC survey results, Zachariah Peterson gives a measured overview of where we are at, and what might happen next.In an analysis of supply chain data and IPC survey results, Zachariah Peterson gives a measured overview of where we are at, and what might happen next.

Automotive Special Report: Faster Buses and Challenging Designs

jlove@signalintegrityjournal.com — Tue, 18 Feb 2020 00:00:00 -0500

Automotive design has captured the public’s imagination, and their expectations are creating countless technical challenges for engineers working in this space. For SI/PI/EMC/EMI engineers, the challenges are unique inside the car due to harsh environments as well as crowded systems.

DesignCon Experts and Companies Take Center Stage

Mon, 10 Feb 2020 00:59:00 -0500

Here’s a roundup of some of the things taking place at DesignCon 2020.

Executive Q&A: Jairo Guerrero, Molex

jlove@signalintegrityjournal.com — Tue, 15 Oct 2019 00:00:00 -0400

What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.

Executive Q&A: Lee McMillan, Noisecom

jlove@signalintegrityjournal.com — Tue, 01 Oct 2019 00:00:00 -0400

SIJ gets Dr. McMillan’s take on what matters for noise generation in SI/PI design, and how PAM4 is arriving.

Executive Interview: Todd Cutler, Keysight

jlove@signalintegrityjournal.com — Thu, 19 Sep 2019 00:00:00 -0400

Recently, Signal Integrity Journal caught up with Todd Cutler, Keysight’s VP and General Manager for Design & Test Software about product development, innovation, and the latest developments in SI/PI design.

Executive Q&A: Larry Williams, ANSYS

jlove@signalintegrityjournal.com — Tue, 13 Aug 2019 00:00:00 -0400

SIJ had the opportunity to engage with Larry Williams, ANSYS director of technology, to find out his thoughts on how modeling and simulation needs have changed, how the industry has responded, and what’s next. At ANSYS, Larry Williams is responsible for the strategic direction of the company’s physics simulation products.

IEEE EMC SI/PI 2019 and all that Jazz

Wed, 31 Jul 2019 09:38:00 -0400

The 2019 IEEE International Symposium on EMC and Signal/Power Integrity (EMC+SIPI) was held in New Orleans for the first time in our 50+ year EMC Society history taking place July 22-26. Read this review of the event.

First Keysight World Americas Event Review

Wed, 15 May 2019 00:00:00 -0400

Industry professionals engaged with Keysight technical experts and executives, and experience live demonstrations May 14 in San Francisco for the first ever Keysight World Americas event. Check out this summary of the event.

EDI CON Online Will Reach Global Audience

Tue, 23 Apr 2019 00:00:00 -0400

The Electronic Design Innovation Conference and Exhibition (EDI CON) announced that this year, in conjunction with Microwave Journal (MWJ) and Signal Integrity Journal (SIJ), it will host an online, interactive event for high frequency and high speed design engineers on September 10-12, 2019.

EDI CON China 2019 Event Summary

Wed, 10 Apr 2019 18:59:00 -0400

EDI CON China 2019 returned to Beijing and the Chinese National Convention Center (CNCC) April 1-3 with an exhibition of 100 industry-leading companies as well as a technical conference that included 2 and a half days of technical presentations, workshops, panels and featured keynote talks.

0.8 mm Connectors Enable D-Band Coaxial Measurements

Fri, 15 Mar 2019 00:00:00 -0400

Design Challenges of Infrastructure for Automotive Wireless Charging

Mon, 11 Mar 2019 16:54:00 -0400

One regularly cited inhibitor to even faster adoption is the need for a public charging infrastructure that is universally available. The technical teams behind these infrastructures are working diligently to both increase the number of currently available plug-in stations as well as drive technological innovation and drive down costs to deliver wireless charging infrastructures available in both public and private spaces. This article examines several of the technical challenges that must be solved to bring this to fruition. First, let’s review the current state of WPT in general, and in automotive applications specifically.

Executive Q&A: Ken Willis, Product Engineering Architect at Cadence

jlove@signalintegrityjournal.com — Tue, 05 Feb 2019 00:00:00 -0500

Executive Q&A with Ken Willis, Product Engineering Architect at Cadence discussing product development, business challenges, and the latest developments in SI/PI design.

Executive Q&A: Steve Sandler, Founder of Picotest

jlove@signalintegrityjournal.com — Thu, 24 Jan 2019 00:00:00 -0500

Executive Q&A with Steve Sandler, Founder of Picotest. Steve Sandler has been involved with power system engineering for nearly 40 years, has been a supporter of SI Journal since its founding, and now sits on its editorial advisory board. Steve is the founder of PICOTEST.com, a company specializing in power integrity solutions including measurement products, services, and training.

EDI CON USA 2018: Conference and Exhibition Review

Fri, 26 Oct 2018 09:30:00 -0400

In case you could not make it to EDI CON USA or just want a quick review of the event, here is summary of the keynotes, conference sessions and product review.

Executive Q&A: Roger Tushingham, Rogers Corporation

jlove@signalintegrityjournal.com — Thu, 27 Sep 2018 17:06:00 -0400

SIJ talked with Roger Tushingham about how to foster innovation and next-generation circuit materials needs.

Executive Q&A: Martin Stumpf, Rohde & Schwarz

jlove@signalintegrityjournal.com — Tue, 14 Aug 2018 00:00:00 -0400

SIJ talked with Martin Stumpf about industry trends, how to foster innovation, and what today’s designers need most from their test equipment.

IEEE EMC+SIPI 2018 Exhibition Summary

Tue, 07 Aug 2018 16:42:00 -0400

The 2018 IEEE EMC+SIPI event returned to Long Beach, CA after last visiting in 2011. The event continues to include Signal Integrity & Power Integrity (SIPI) as part of the conference, reflecting the EMC Society’s influence and focus on this critical topic of engineering design.

Samtec and Molex Share IP to Reshape Future of Connectors

jlove@signalintegrityjournal.com — Mon, 16 Jul 2018 00:00:00 -0400

This spring, Molex and Samtec announced a collaboration on next-generation data center solutions. SIJ caught up with Brian Vicich of Samtec, Inc and Brent Hatfield of Molex to find out what that means for engineers.

Executive Q&A: David Kohlmeier, Mentor, A Siemens Business

jlove@signalintegrityjournal.com — Fri, 29 Jun 2018 00:00:00 -0400

SIJ talked with Dave Kohlmeier about industry trends, how to foster innovation, and what today’s EDA customers need most.

EDI CON China 2018 Announces Winners In Innovation Awards

Wed, 21 Mar 2018 00:00:00 -0400

Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.

The IEEE MOVE truck

Mon, 05 Mar 2018 11:43:12 -0500

Many of us are familiar with the IEEE for its technical conferences, and development and publication of technical standards. A far smaller number of us know that it’s also a humanitarian organization, with a motto of “Advancing Technology for Humanity.” This article is about that little-known aspect of IEEE.