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      <title>PAM2 vs. PAM4 Signaling: Simply Explained </title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4288</guid>
      <pubDate>Thu, 18 Jun 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4288-pam2-vs-pam4-signaling-simply-explained</link>
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        <media:title type="plain">4288 PAM2 vs. PAM4.png</media:title>
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      <title>When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4287</guid>
      <pubDate>Wed, 17 Jun 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4287-when-frequency-shapes-time-how-s-parameter-properties-shape-simulated-tdr-behavior</link>
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        <media:title type="plain">4287 When Frequency Shapes Time.png</media:title>
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      <title>Evolution of the PDN Design Process: Explaining the Second Paradigm Shift</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4286</guid>
      <pubDate>Sun, 17 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4286-evolution-of-the-pdn-design-process-explaining-the-second-paradigm-shift</link>
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        <media:title type="plain">4286 Evolution of the PDN.png</media:title>
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      <title>Machine Learning Models for SI/PI Analysis with Meshed Planes</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4277</guid>
      <pubDate>Wed, 13 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4277-machine-learning-models-for-si-pi-analysis-with-meshed-planes</link>
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        <media:title type="plain">Cadence.png</media:title>
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      <title>Stop Breaking the Loop: Modern Closed-Loop Stability in ADS</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4284</guid>
      <pubDate>Mon, 27 Apr 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4284-stop-breaking-the-loop-modern-closed-loop-stability-in-ads</link>
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        <media:title type="plain">Stop Breaking the Loop: Modern Closed-Loop Stability in ADS</media:title>
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      <title>AI-Assisted HFSS Modeling For 100 GHz+ High-Speed Interconnect Design</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4274</guid>
      <pubDate>Tue, 21 Apr 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4274-ai-assisted-hfss-modeling-for-100-ghz-high-speed-interconnect-design</link>
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        <media:title type="plain">HYPERLABS</media:title>
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      <title>Why Power Architectures Constrain New Space AI Missions</title>
      <description></description>
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      <guid>http://www.signalintegrityjournal.com/articles/4275</guid>
      <pubDate>Mon, 20 Apr 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4275-why-power-architectures-constrain-new-space-ai-missions</link>
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        <media:title type="plain">Vicor</media:title>
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      <title>Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms</title>
      <description>This article describes the use of Cadence’s Sigrity signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.</description>
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        <![CDATA[<p>This article describes the use of Cadence’s&nbsp;Sigrity<sup>&nbsp;</sup>signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/4099</guid>
      <pubDate>Wed, 18 Feb 2026 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4099-optimization-of-ibis-ami-model-parameters-with-machine-learning-algorithms</link>
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      <title>Material-Induced Skew in High-Speed Multilayer PCBs: Influences and Mitigation Strategies</title>
      <description>Among various forms of signal degradation, skew is a key contributor to timing errors in systems operating at multi-gigabit data rates. An increasingly important factor at high speeds is material-induced skew due to local differences in dielectric constant arising from the PCB’s woven glass fabric reinforcement. This article aims to unpack the root causes of material-induced skew, particularly focusing on the glass weave effect, and explores mitigation techniques ranging from laminate selection to signal routing strategies.</description>
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        <![CDATA[<p>Among various forms of signal degradation, skew is a key contributor to timing errors in systems operating at multi-gigabit data rates. An increasingly important factor at high speeds is material-induced skew due to local differences in dielectric constant arising from the PCB’s woven glass fabric reinforcement. This article aims to unpack the root causes of material-induced skew, particularly focusing on the glass weave effect, and explores mitigation techniques ranging from laminate selection to signal routing strategies.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/4105</guid>
      <pubDate>Sat, 17 Jan 2026 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4105-material-induced-skew-in-high-speed-multilayer-pcbs-influences-and-mitigation-strategies</link>
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      <title>The Imperfect Via: The Rough Truth Lurks Beneath the Surface</title>
      <author>lsimonovich@lamsimenterprises.com</author>
      <description>Bert Simonovich explains why material anisotropy is not solely responsible for contributing to Dkeff surrounding a via hole structure. The via barrel conductor roughness and resin content of the as-fabricated dielectric pressed thicknesses must be considered and adjusted before applying this heuristic method to calculate Dkxy.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Bert Simonovich explains why material anisotropy is not solely responsible for contributing to Dkeff surrounding a via hole structure. The via barrel conductor roughness and resin content of the as-fabricated dielectric pressed thicknesses must be considered and adjusted before applying this heuristic method to calculate Dkxy.</span>
</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/4107</guid>
      <pubDate>Sat, 10 Jan 2026 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4107-the-imperfect-via-the-rough-truth-lurks-beneath-the-surface</link>
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      <title>Using Ultra-Broadband Baluns to Perform Differential S-Parameter Measurements Using Single-Ended 2-Port VNA</title>
      <description>This article demonstrates accurate differential S-parameter measurements obtained from a single-ended 2-port VNA using ultra-broadband baluns and attenuators. This measurement system is a cost-effective alternative to purchasing a multi-port test set for a VNA.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">This article demonstrates accurate differential S-parameter measurements obtained from a single-ended 2-port VNA using ultra-broadband baluns and attenuators. This measurement system is a cost-effective alternative to purchasing a multi-port test set for a VNA.&nbsp;</span></p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/4102</guid>
      <pubDate>Tue, 09 Dec 2025 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4102-using-ultra-broadband-baluns-to-perform-differential-s-parameter-measurements-using-single-ended-2-port-vna</link>
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      <title>Seeing Through the Noise: Reliable Power Rail Measurements in High-Current AI Systems</title>
      <description>In this article, power rail voltage measurement uncertainty is examined using several different probe configurations to monitor VCore measurements on a Picotest S2000 load stepper board. The results reveal measurement variations up to 27 mV — a level of uncertainty that can completely mask the performance improvements engineers are seeking from advanced VRM technologies. Read on to learn how engineers can trust their measurements when the uncertainty exceeds the performance gains they are trying to validate.</description>
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        <![CDATA[<p>In this article, power rail voltage measurement uncertainty is examined using several different probe configurations to monitor VCore measurements on a Picotest S2000 load stepper board. The results reveal measurement variations up to 27 mV — a level of uncertainty that can completely mask the performance improvements engineers are seeking from advanced VRM technologies. Read on to learn how engineers can trust their measurements when the uncertainty exceeds the performance gains they are trying to validate.</p><br>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/4101</guid>
      <pubDate>Wed, 19 Nov 2025 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4101-seeing-through-the-noise-reliable-power-rail-measurements-in-high-current-ai-systems</link>
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      <title>The Impact of AI at the Singularity</title>
      <description>As Ray Kurzweil’s predictions edge closer to reality, AI continues to transform engineering, education, and daily life. Follow along as Signal Integrity Journal Technical Editor Eric Bogatin examines the risks and rewards of technological evolution while reflecting on the role of humans in an AI-driven future.</description>
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        <![CDATA[<p>As Ray Kurzweil’s predictions edge closer to reality, AI continues to transform engineering, education, and daily life. Follow along as&nbsp;<em>Signal Integrity Journal</em> Technical Editor Eric Bogatin examines the risks and rewards of technological evolution while reflecting on the role of humans in an AI-driven future.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/blogs/4/post/4093</guid>
      <pubDate>Sun, 02 Nov 2025 23:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/blogs/4-eric-bogatin-signal-integrity-journal-technical-editor/post/4093-the-impact-of-ai-at-the-singularity</link>
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      <title>ManyPoint Networks: A System Co-Design Framework for 448 Gbps AI Fabrics and Beyond</title>
      <description>This article introduces a hardware-centric definition of compute cluster bisection bandwidth as a performance metric for AI-scale 448 Gbps systems. Unlike traditional abstractions, this metric is grounded in physical interconnect layout and IO port availability, enabling system architects to evaluate bandwidth provisioning through real, bidirectional link paths.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">This article introduces a hardware-centric definition of compute cluster bisection bandwidth as a performance metric for AI-scale 448 Gbps systems. Unlike traditional abstractions, this metric is grounded in physical interconnect layout and IO port availability, enabling system architects to evaluate bandwidth provisioning through real, bidirectional link paths.</span></p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/4084</guid>
      <pubDate>Sun, 19 Oct 2025 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4084-manypoint-networks-a-system-co-design-framework-for-448-gbps-ai-fabrics-and-beyond</link>
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      <title>How to Simulate Low Voltage, High Power 2000 Amps to a Dynamic Digital Load</title>
      <description>EM simulators that are optimized for PCB PDN simulations provide an increased level of automation to enable the basics of DC IR Drop, electrothermal, and AC impedance for early detection of design issues. In this article, Heidi Barnes, Steve Sandler, and Benjamin Dannan examine why the ability to optimize a PDN for ZTarget with PCB parasitics in the frequency domain and then export to an end-to-end PI Digital Twin simulation for validation in the time domain should be standard practice for the PI engineer.</description>
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        <![CDATA[<p>EM simulators that are optimized for PCB PDN simulations provide an increased level of automation to enable the basics of DC IR Drop, electrothermal, and AC impedance for early detection of design issues. In this article, Heidi Barnes, Steve Sandler, and Benjamin Dannan examine why the ability to optimize a PDN for Z<sub>Target</sub> with PCB parasitics in the frequency domain and then export to an end-to-end PI Digital Twin simulation for validation in the time domain should be standard practice for the PI engineer.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/3788</guid>
      <pubDate>Sat, 22 Mar 2025 01:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3788-how-to-simulate-low-voltage-high-power-2000-amps-to-a-dynamic-digital-load</link>
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        <media:title type="plain">Cover Feature 2025 Cover 12-19-25.png</media:title>
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      <title>A Subtle Problem to Avoid in Your Next Design</title>
      <description>When designing circuit boards, a change made to one aspect of the design intended to resolve an issue can cause problems elsewhere. To reduce the problem of soldering on SMA connectors in an edge launch, a significant signal integrity problem has been introduced. This article explores best practices and provides insight into avoiding an inadvertent mistake.</description>
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        <![CDATA[<p>When designing circuit boards, a change made to one aspect of the design intended to resolve an issue can cause problems elsewhere. To reduce the problem of soldering on SMA connectors in an edge launch, a significant signal integrity problem has been introduced. This article explores best practices and provides insight into avoiding an inadvertent mistake.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/3810</guid>
      <pubDate>Sat, 15 Mar 2025 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3810-a-subtle-problem-to-avoid-in-your-next-design</link>
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        <media:title type="plain">A Subtle Problem to Avoid 1-2-25.png</media:title>
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      <title>Analysis of Skew</title>
      <description>Intra-pair skew is a crucial metric when working with multiple lines. Its behavior, measurements, and interpretations are closely linked to other forms of signal degradation, making the definition of a single skew value a nuanced issue that requires careful consideration. In this article, Gustavo Blando and Prashant Pappu introduce three distinct methods for measuring skew, providing options for a wide variety of contexts and skew measurement goals.</description>
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        <![CDATA[<p>Intra-pair skew is a crucial metric when working with multiple lines. Its behavior, measurements, and interpretations are closely linked to other forms of signal degradation, making the definition of a single skew value a nuanced issue that requires careful consideration. In this article, Gustavo Blando and Prashant Pappu introduce three distinct methods for measuring skew, providing options for a wide variety of contexts and skew measurement goals.</p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3809</guid>
      <pubDate>Sat, 15 Feb 2025 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3809-analysis-of-skew</link>
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      <title>Ultrafast Impedance Measurement of Active Ultra-High Current PDNs</title>
      <description>In this article, Steve Sandler presents three viable solutions for measuring ultra-low impedance with a maximum of 10 ms, each of which can be performed using sophisticated and novel FFT based 3-port measurement. These methods involve applying digitally modulated patterns to create modulated load currents up to 1500 A and recording the resulting power rail voltage perturbations.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">In this article, Steve Sandler presents three viable solutions for measuring ultra-low impedance with a maximum of 10 ms, each of which can be performed using sophisticated and novel FFT based 3-port measurement. These methods involve applying digitally modulated patterns to create modulated load currents up to 1500 A and recording the resulting power rail voltage perturbations.&nbsp;</span></p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3798</guid>
      <pubDate>Thu, 06 Feb 2025 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3798-ultrafast-impedance-measurement-of-active-ultra-high-current-pdns</link>
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      <title>The Need for Speed and the Cost in Power</title>
      <description>The need for speed will be the driving force behind energy production and efforts to make increasingly efficient use of available energy. Eric Bogatin reflects upon the evolution of power resources from the Industrial Revolution to today’s generation of AI and network processors.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">The need for speed will be the driving force behind energy production and efforts to make increasingly efficient use of available energy.</span> Eric Bogatin reflects upon the evolution of power resources from the Industrial Revolution to today’s generation of AI and network processors. 
 </p>]]>
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      <guid>http://www.signalintegrityjournal.com/blogs/4/post/3791</guid>
      <pubDate>Sun, 12 Jan 2025 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/blogs/4-eric-bogatin-signal-integrity-journal-technical-editor/post/3791-the-need-for-speed-and-the-cost-in-power</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2025/thumb/Editors-Note-Cover-12-19-24.webp?t=1736264685" type="image/png" medium="image" fileSize="140842">
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      <title>Who Put That Inductor in My Capacitor?
</title>
      <description>This article covers the importance of proper calibration, measurement, and de-embedding to ensure that the final capacitor model is free of errors, allowing an accurate representation of the PDN used in simulation. While capacitor models may play a seemingly minor role in the overall system design, the impact of capacitor models can significantly impact the system design and, importantly, design sign-off.</description>
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        <![CDATA[<p>This article covers the importance of proper calibration, measurement, and de-embedding to ensure that the final capacitor model is free of errors, allowing an accurate representation of the PDN used in simulation. While capacitor models may play a seemingly minor role in the overall system design, the impact of capacitor models can significantly impact the system design and, importantly, design sign-off.</p>]]>
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      <guid>http://www.signalintegrityjournal.com/articles/3445</guid>
      <pubDate>Mon, 06 May 2024 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3445-who-put-that-inductor-in-my-capacitor</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/2024/02/06/Who-Put-That-Inductor-in-My-Capacitor-Cover-2024.webp?t=1713900051" type="image/jpeg" medium="image" fileSize="32505">
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      <title>Introducing an Upcoming IEEE Packaging Benchmark</title>
      <description>In recent years, the IEEE Electrical Packaging Society technical committee for electrical design, modeling, and simulation recognized the need for open-source benchmarks for the simulation tool, verification, and test and measurement solution vendors. The intention is to overcome the obstacles that developers and users of such tools and instruments often encounter and create a growing library of benchmark cases for signal and power integrity challenges. As of October 2023, there are four published benchmark cases in the repository. This article describes a proposal for a fifth benchmark.</description>
      <content:encoded>
        <![CDATA[<p>In recent years, the IEEE Electrical Packaging Society technical committee for electrical design, modeling, and simulation recognized the need for open-source benchmarks for the simulation tool, verification, and test and measurement solution vendors. The intention is to overcome the obstacles that developers and users of such tools and instruments often encounter and create a growing library of benchmark cases for signal and power integrity challenges. As of October 2023, there are four published benchmark cases in the repository. This article describes a proposal for a fifth benchmark.</p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3430</guid>
      <pubDate>Wed, 03 Apr 2024 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3430-introducing-an-upcoming-ieee-packaging-benchmark</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2023/thumb/Introducing-an-Upcoming-IEEE-Packaging-Benchmark-Cover.webp?t=1712031195" type="image/png" medium="image" fileSize="113866">
        <media:title type="plain">Introducing an Upcoming IEEE Packaging Benchmark Cover.png</media:title>
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    <item>
      <title>PCB Laminate Anisotropy: The Impact on Advanced Via Modeling</title>
      <author>lsimonovich@lamsimenterprises.com</author>
      <description>Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dkz values instead of in-plane Dkxy values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested.</description>
      <content:encoded>
        <![CDATA[<p>Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dk<sub>z</sub> values instead of in-plane Dk<sub>xy</sub> values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested. </p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3422</guid>
      <pubDate>Wed, 20 Mar 2024 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3422-pcb-laminate-anisotropy-the-impact-on-advanced-via-modeling</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2023/thumb/PCB-Laminate-Anisotropy-The-Impact-on-Advanced-Via-Modeling-1-25-24.webp?t=1710822668" type="image/png" medium="image" fileSize="92236">
        <media:title type="plain">PCB Laminate Anisotropy The Impact on Advanced Via Modeling 1-25-24.png</media:title>
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      <title>Worst-Case Bit-Pattern Generator for Eye Diagram Analysis of Non-LTI High-Speed Channels</title>
      <description>In this article, a machine learning approach based on Bayesian Optimization is proposed that creates an optimized bit pattern to maximize the ISI, resulting in faster convergence of eye diagram analysis. Numerical results demonstrate up to 14x speedup and more accurate results compared to the conventional eye diagram analysis.</description>
      <content:encoded>
        <![CDATA[<div style="font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px;">In this article, a machine learning approach based on Bayesian Optimization is proposed that creates an optimized bit pattern to maximize the ISI, resulting in faster convergence of eye diagram analysis. Numerical results demonstrate up to 14x speedup and more accurate results compared to the conventional eye diagram analysis.</div><p> </p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3447</guid>
      <pubDate>Tue, 06 Feb 2024 23:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3447-worst-case-bit-pattern-generator-for-eye-diagram-analysis-of-non-lti-high-speed-channels</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2024/thumb/Worst-Case-Bit-Pattern-Cover.webp?t=1713283467" type="image/jpeg" medium="image" fileSize="26339">
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      <title>The Road from 1 Gbps-NRZ to 224 Gbps-PAM4</title>
      <description>Semiconductor signal conditioning and signal recovery innovations have extended data rates by managing allowable signal-to-noise ratio (SNR) at progressively higher Nyquist frequencies. We have experienced how each successive signaling technology increases the electro-mechanical design resolution needed to address the channel physics while respecting the SNR of the chips. These movements throughout the years have provided a baseline of traditional design goals that lead us to better understand today’s 224 Gbps-PAM4 physical layer requirements.</description>
      <content:encoded>
        <![CDATA[<p>Semiconductor signal conditioning and signal recovery innovations have extended data rates by managing allowable signal-to-noise ratio (SNR) at progressively higher Nyquist frequencies. We have experienced how each successive signaling technology increases the electro-mechanical design resolution needed to address the channel physics while respecting the SNR of the chips. These movements throughout the years have provided a baseline of traditional design goals that lead us to better understand today’s 224 Gbps-PAM4 physical layer requirements.</p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/3391</guid>
      <pubDate>Sat, 27 Jan 2024 00:00:24 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/3391-the-road-from-1-gbps-nrz-to-224-gbps-pam4</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2023/thumb/The-Road-from-1-Gbps-NRZ-to-224-Gbps-PAM4.webp?t=1705038824" type="image/png" medium="image" fileSize="90250">
        <media:title type="plain">The Road from 1 Gbps-NRZ to 224 Gbps-PAM4.png</media:title>
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      <title>Generative AI is in Your Future</title>
      <description>In just two generations, six different technological revolutions have transformed our economy, our careers, and our quality of life, for better or for worse. Eric Bogatin reflects upon industry progress and explores the potential impact of the latest development in technological innovation, generative AI.</description>
      <content:encoded>
        <![CDATA[<p>In just two generations, six different technological revolutions have transformed our economy, our careers, and our quality of life, for better or for worse. Eric Bogatin reflects upon industry progress and explores the potential impact of the latest development in technological innovation, generative AI.</p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/blogs/4/post/3387</guid>
      <pubDate>Sat, 13 Jan 2024 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/blogs/4-eric-bogatin-signal-integrity-journal-technical-editor/post/3387-generative-ai-is-in-your-future</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2023/thumb/Editors-Note-1-17-24.webp?t=1705528224" type="image/png" medium="image" fileSize="86586">
        <media:title type="plain">Editor's Note 1-17-24.png</media:title>
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    <item>
      <title>Avoiding GIGO with Field Solvers</title>
      <author>lsimonovich@lamsimenterprises.com</author>
      <description>In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.</description>
      <content:encoded>
        <![CDATA[<p>In this article, Bert Simonovich explores how t<span style="color: rgb(65, 65, 65); letter-spacing: normal; orphans: 2; text-align: left; white-space: normal; widows: 2; word-spacing: 0px; display: inline !important; float: none;">o avoid “garbage in, garbage out” with field solvers by building an understanding of</span> the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.</p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/2995</guid>
      <pubDate>Thu, 16 Mar 2023 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/2995-avoiding-gigo-with-field-solvers</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/images/Newsletters/News/News_1/Avoiding-GIGO-3-14-23.webp?t=1678808477" type="image/jpeg" medium="image" fileSize="27476">
        <media:title type="plain">Avoiding GIGO 3-14-23.jpg</media:title>
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    </item>
    <item>
      <title>Ultra-Fine Line Differential Pair Design with No Return Plane</title>
      <author>Chaithra.Suresh@colorado.edu</author>
      <description>In part three of the Ultra-Fine Line Design Guide series, previously introduced methodology is used to explore the design space for a differential pair when the return plane is far enough away that coupling to it is negligible. Read on.</description>
      <content:encoded>
        <![CDATA[<p>In part three of the Ultra-Fine Line Design Guide series, previously introduced methodology is used to explore the design space for a differential pair when the return plane is far enough away that coupling to it is negligible. Read on. </p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/2859</guid>
      <pubDate>Thu, 09 Feb 2023 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/2859-ultra-fine-line-differential-pair-design-with-no-return-plane</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/2023/02/01/SIJ_Article2991_feb23.webp?t=1677789767" type="image/jpeg" medium="image" fileSize="73730">
        <media:title type="plain">SIJ_Article2991_feb23.jpg</media:title>
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    </item>
    <item>
      <title>Troubleshooting Low-Frequency Common Mode Emissions</title>
      <author>min.zhang@mach1design.co.uk</author>
      <description>This article presents case studies where troubleshooting tools such as RF current probes and resistive probes proved effective in troubleshooting low-frequency conducted emissions. Read on.</description>
      <content:encoded>
        <![CDATA[<p>This article presents case studies where troubleshooting tools such as RF current probes and resistive probes proved effective in troubleshooting low-frequency conducted emissions. Read on. </p>]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/2965</guid>
      <pubDate>Wed, 01 Feb 2023 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/2965-troubleshooting-low-frequency-common-mode-emissions</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/2023/01/18/unnamed.webp?t=1674536745" type="image/jpeg" medium="image" fileSize="71056">
        <media:title type="plain">unnamed.jpg</media:title>
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      <title>Rogers Corporation Exhibiting at DesignCon 2023</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/2986</guid>
      <pubDate>Sun, 01 Jan 2023 00:00:50 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/2986-rogers-corporation-exhibiting-at-designcon-2023</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2019/Industry-News_Thumb.webp?t=1629234050" type="image/jpeg" medium="image" fileSize="51798">
        <media:title type="plain">Industry News Thumb</media:title>
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      <title>Anritsu to Showcase Test Leadership for High-speed Communications Verification at DesignCon 2023</title>
      <description></description>
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        <![CDATA[]]>
      </content:encoded>
      <guid>http://www.signalintegrityjournal.com/articles/2989</guid>
      <pubDate>Sun, 01 Jan 2023 00:00:00 -0500</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/2989-anritsu-to-showcase-test-leadership-for-high-speed-communications-verification-at-designcon-2023</link>
      <media:content url="https://www.signalintegrityjournal.com/ext/resources/article-images-2019/Industry-News_Thumb.webp?t=1629234050" type="image/jpeg" medium="image" fileSize="51798">
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