Signal Integrity Journal

Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era

Wed, 20 May 2026 00:00:00 -0400

Analog Devices, Inc. (NASDAQ: ADI) and Empower Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.

Richardson Electronics Announces Strategic Technology Partnership with NoMIS Power to Advance Silicon Carbide Solutions

Wed, 20 May 2026 00:00:00 -0400

Infineon CoolGaN™ BDS 40 V G3 Family Delivers up to 82 Percent Footprint Reduction for Portable Power Designs

Wed, 20 May 2026 00:00:00 -0400

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S.

Outside China, 5G Drives Core Network Revenue Even Higher, According to Dell’Oro Group

Tue, 19 May 2026 00:00:00 -0400

According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, 5G Mobile Core Network (MCN) revenue grew at double-digit rates outside China, whereas in China revenues dropped more severely than any quarter since 5G was introduced to the market.

Optical Transport Equipment Market Forecast to Grow 16 Percent in 2026, According to Dell’Oro Group

Tue, 19 May 2026 00:00:00 -0400

According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the Optical Transport equipment market is forecast to grow 16 percent in 2026, surpassing $18 billion in manufacturer revenue for the first time since the year 2000, due to the rising demand for network infrastructure brought on by AI data centers.

PAM2 vs. PAM4 Signaling: Simply Explained

Mon, 18 May 2026 00:00:00 -0400

3D Interconnect Designer: Physically Accurate Design and Exploration of Advanced 2.5D and 3D Interconnects

Fri, 15 May 2026 09:34:00 -0400

This solution brief introduces Keysight 3D Interconnect Designer, a physically aware environment for early exploration and validation of advanced interconnect architectures. It enables modeling and analysis of complex 2.5D and 3D structures during the architectural phase, helping teams reduce risk, accelerate development, and improve confidence before detailed physical implementation.

When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Thu, 14 May 2026 00:00:00 -0400

Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference

Wed, 13 May 2026 00:00:00 -0400

New AWG Function Accelerates Automated Testing Processes

Wed, 13 May 2026 00:00:00 -0400

Spectrum Instrumentation, a leading provider of more than 70 high-performance AWG products for all kinds of industries, now presents an additional AWG mode for automated testing environments.

Machine Learning Models for SI/PI Analysis with Meshed Planes

Wed, 13 May 2026 00:00:00 -0400

HYPERLABS Expands Pacific Northwest Presence Through PSI Solutions Partnership

Tue, 12 May 2026 00:00:00 -0400

HYPERLABS is pleased to announce a new partnership with PSI Solutions, which will now represent HYPERLABS products throughout the Pacific Northwest territory.

IMS2026: The RF and Microwave Event Comes to Boston, June 7–12

Tue, 12 May 2026 00:00:00 -0400

The 2026 IEEE International MTT Symposia (IMS2026) convenes 7-12 June 2026 at the Thomas M. Menino Convention and Exhibition Center (MCEC), bringing 500+ exhibiting companies and more than 8,000 engineers, researchers, academics, and technology leaders from around the world to Boston.

Infineon’s new XHP™ 2 CoolSiC™ High-Power Modules Boost Efficiency and Power Density in High-Voltage Energy Systems

Mon, 11 May 2026 00:00:00 -0400

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems.

Evolution of the PDN Design Process: Explaining the Second Paradigm Shift

Mon, 11 May 2026 00:00:00 -0400

Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

Sun, 10 May 2026 00:00:00 -0400

Infineon Technologies AG announced a collaboration with d-Matrix^®, a pioneer in highly interactive, low-latency AI inference compute for data centers.

SIJ Publishes April 2026 Issue

Sat, 09 May 2026 00:00:59 -0400

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!

PCIe® 8.0 Specification, Draft 0.5 Now Available: On Track for 256.0 GT/s Transfer Speeds by 2028

Wed, 06 May 2026 15:00:00 -0400

The PCI-SIG technical work groups are hard at work on the PCI Express® (PCIe®) 8.0 specification, and we are pleased to announce that draft 0.5 is now available for member review – ahead of schedule for a typical draft 0.5 release.

Keysight PCIe 7.0 Receiver Stress Calibration at 128GT/s

Wed, 06 May 2026 00:00:00 -0400

Keysight Technologies, Inc. today announced a new PCIe® 7.0 Receiver (RX) Test application, extending its PCIe 7.0 portfolio to enable end-to-end transmitter and receiver validation.

Rohde & Schwarz Highlights New High‑Gain Antennas and Fast EMI Testing at APEMC 2026 in Kuala Lumpur

Tue, 05 May 2026 00:00:15 -0400

VIAVI Launches CyberFlood CF1000 Appliance for Next-Generation Validation of Multi-Terabit Security and AI Infrastructure

Tue, 05 May 2026 00:00:00 -0400

SiTime Boosts GPU Utilization in AI Data Centers with Elite 2 Super-TCXO

Mon, 04 May 2026 11:18:00 -0400

The Role of Precision Timing in Enabling Higher Bandwidth Per Rack Without Compromising Signal Integrity or Efficiency

Mon, 04 May 2026 00:00:44 -0400

GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Centers with SCALE Optical Module Solution

Mon, 04 May 2026 00:00:00 -0400

GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).

Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain

Sun, 03 May 2026 00:00:00 -0400

Indium Corporation today announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.

OKI Develops 180-Layer 15 mm-Thick PCB Technologies for Next-Generation AI Semiconductor Testing Equipment

Thu, 30 Apr 2026 12:18:50 -0400

The OKI Group's printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (*1) mounted on AI semiconductors.

Skyworks Introduces Si86Px Digital Isolators with Integrated Power for Space‑Constrained Industrial Designs

Thu, 30 Apr 2026 00:00:00 -0400

Skyworks today announced the Si86Px family of digital isolators with integrated power, a compact solution that combines high‑performance digital isolation with an integrated isolated dc‑dc converter and matched miniature transformer.

New VITA 91 High Density VPX Backplanes from Pixus

Wed, 29 Apr 2026 00:00:00 -0400

Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new line of VITA 91 compliant backplanes.

New Samtec SMA Interconnects Capable of 26.5 GHz

Tue, 28 Apr 2026 00:00:00 -0400

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

Signal Integrity IP Market To Reach USD 3.75 billion by 2033

Tue, 28 Apr 2026 00:00:00 -0400

The Signal Integrity IP market is quietly becoming one of the most influential enablers of next-generation electronics, particularly in the United States, where innovation in semiconductors, data centers, and AI hardware is accelerating at an unprecedented pace.

Signal Integrity Journal

Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era

Richardson Electronics Announces Strategic Technology Partnership with NoMIS Power to Advance Silicon Carbide Solutions

Infineon CoolGaN™ BDS 40 V G3 Family Delivers up to 82 Percent Footprint Reduction for Portable Power Designs

Outside China, 5G Drives Core Network Revenue Even Higher, According to Dell’Oro Group

Optical Transport Equipment Market Forecast to Grow 16 Percent in 2026, According to Dell’Oro Group

PAM2 vs. PAM4 Signaling: Simply Explained

3D Interconnect Designer: Physically Accurate Design and Exploration of Advanced 2.5D and 3D Interconnects

When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference

New AWG Function Accelerates Automated Testing Processes

Machine Learning Models for SI/PI Analysis with Meshed Planes

HYPERLABS Expands Pacific Northwest Presence Through PSI Solutions Partnership

IMS2026: The RF and Microwave Event Comes to Boston, June 7–12

Infineon’s new XHP™ 2 CoolSiC™ High-Power Modules Boost Efficiency and Power Density in High-Voltage Energy Systems

Evolution of the PDN Design Process: Explaining the Second Paradigm Shift

Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

SIJ Publishes April 2026 Issue

PCIe® 8.0 Specification, Draft 0.5 Now Available: On Track for 256.0 GT/s Transfer Speeds by 2028

Keysight PCIe 7.0 Receiver Stress Calibration at 128GT/s

Rohde & Schwarz Highlights New High‑Gain Antennas and Fast EMI Testing at APEMC 2026 in Kuala Lumpur

VIAVI Launches CyberFlood CF1000 Appliance for Next-Generation Validation of Multi-Terabit Security and AI Infrastructure

SiTime Boosts GPU Utilization in AI Data Centers with Elite 2 Super-TCXO

The Role of Precision Timing in Enabling Higher Bandwidth Per Rack Without Compromising Signal Integrity or Efficiency

GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Centers with SCALE Optical Module Solution

Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain

OKI Develops 180-Layer 15 mm-Thick PCB Technologies for Next-Generation AI Semiconductor Testing Equipment

Skyworks Introduces Si86Px Digital Isolators with Integrated Power for Space‑Constrained Industrial Designs

New VITA 91 High Density VPX Backplanes from Pixus

New Samtec SMA Interconnects Capable of 26.5 GHz

Signal Integrity IP Market To Reach USD 3.75 billion by 2033

Rohde & Schwarz Highlights New High‑Gain Antennas and Fast EMI Testing at APEMC 2026 in Kuala Lumpur