Signal Integrity Journal

Keysight Showcases Link Layer Retry Interoperability with Alibaba Cloud at 2026 OCP Global Summit

Tue, 13 Oct 2026 08:52:22 -0400

Keysight Technologies, Inc. will demonstrate multi-vendor interoperability of Link Layer Retry (LLR) for the first time in joint demonstrations with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit in San Jose, October 12 to 15.

Breaking the Memory Wall: Signal and Power Integrity Challenges of AI Scale-Up

Tue, 13 Oct 2026 06:29:02 -0400

The memory wall, once a niche topic for computer architects arguing over cache hierarchies, now shapes how AI data centers are physically built. As large language models move from training into round-the-clock inference, the industry is now pushing against the limits of physics. The problem is how to move enough bytes between memory and logic, and between accelerators, within the loss, noise, power and thermal budgets of copper, optics and power delivery networks.

Power Integrity Correlation of Ultra-Low-Impedance Via-Field Measurements

Mon, 12 Oct 2026 00:00:00 -0400

Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.

Looking Ahead with Signal Integrity Journal

Sun, 11 Oct 2026 00:00:00 -0400

It is my privilege to introduce myself as the newest Technical Editor for Signal Integrity Journal, a role I take on alongside my full-time position as Senior Director of R&D for Compute, Storage, Optical Transport, and High-Speed Ethernet Test Solutions at VIAVI Solutions.

Modeling and Measuring Large Signal PDN Crosstalk and Ground Bounce with a Multi-Phase VRM System Using a Fast Multi-Domain BGA Step Load

Thu, 08 Oct 2026 00:00:00 -0400

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

Mitigation of Ionizing Radiation Degradation in Linear Regulators Using eGaN HEMTs

Wed, 07 Oct 2026 00:00:00 -0400

Traditional space LDOs rely on silicon MOSFETs that suffer from radiation degradation. To solve this, Tony Marini from EPC Space highlights a revolutionary alternative using enhancement-mode Gallium Nitride (eGaN) HEMTs. Their unique material physics inherently resists Total Ionizing Dose (TID) effects without performance loss, ensuring exceptional parameter stability in harsh orbital environments.

Methods to Model and Measure Noise Mitigation with Embedded Capacitors in High Current PDNs for AI and Cloud Compute

Tue, 06 Oct 2026 00:00:00 -0400

The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.

Signal Integrity Monitoring for Vehicles Market to Reach USD 4.37 Billion by 2034

Mon, 05 Oct 2026 00:00:00 -0400

According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.

Optical I/O for AI Chips Market to Reach USD 14 Billion by 2035

Sun, 04 Oct 2026 08:37:48 -0400

The global optical I/O for AI chips market was valued at USD 1.1 billion in 2025 and is estimated to grow at a CAGR of 27.8% to reach USD 14 billion by 2035, according to recent report by Global Market Insights Inc.

Signal Integrity Journal Welcomes Benoit Derat as Technical Advisor

Sat, 03 Oct 2026 00:00:46 -0400

Signal Integrity Journal is pleased to welcome Benoit Derat as its newest Technical Advisor.

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects for Next-Generation AI Data Centers

Sun, 27 Sep 2026 13:14:22 -0400

Molex, a global electronics leader and connectivity innovator, introduced VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks.

HYPERLABS Expands 145 GHz Component Line with New HL8818 Broadband Termination

Fri, 25 Sep 2026 00:00:00 -0400

HYPERLABS has expanded its 0.8 mm, 145 GHz component series with the introduction of the HL8818 Broadband 50Ω Termination.

Samtec to Exhibit at ECOC 2026

Wed, 16 Sep 2026 00:00:25 -0400

Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high performance optical and copper interconnect solutions in booth #2004 at the upcoming ECOC exhibition.

Wi2Wi Announces US$2.6 M Three-Year Contract with a Confidential Defense Organization, Stock Option Grant and Investor Relations Engagement

Mon, 14 Sep 2026 00:00:00 -0400

Wi2Wi Corporation announces that it has entered into a three-year contract, valued at US$2.6 million, with a confidential defense organization for Precision Devices products for an aerospace application.

Samtec 1.0 mm Connectors Capable of DC to 120 GHz

Sun, 13 Sep 2026 00:00:00 -0400

Samtec, Inc. announces the release of its 1.0 mm vertical compression mount board connector, the 100-CM Series.

VIAVI Joins EU-Funded SHIELD-6G Consortium to Advance AI-Driven Security Testing for Future 6G Networks

Sun, 06 Sep 2026 00:00:50 -0400

VIAVI Solutions Inc. announced that it has been awarded $1.1 million in funding from the European Smart Networks and Services Joint Undertaking (SNS JU) and Horizon Europe to advance the SHIELD-6G project.

Maintaining Signal Integrity in Automated Production

Sat, 05 Sep 2026 00:00:47 -0400

While global manufacturing continues to push toward more automated production, unplanned outages now cost the sector an average of $852 million every week. As factories integrate high-speed data signals alongside mixed-voltage power architectures, the physical layer has become a determining factor in system stability rather than a background consideration.

When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Wed, 02 Sep 2026 00:00:00 -0400

PAM2 vs. PAM4 Signaling: Simply Explained

Tue, 01 Sep 2026 00:00:00 -0400

Advanced Packaging and SI: Simulating Electromagnetic, Thermal, and Mechanical Effects

Fri, 28 Aug 2026 09:57:01 -0400

This eBook explores how multiphysics simulation is enabling engineers to address the growing complexity of advanced packaging and signal integrity design. Covering topics such as high-speed interconnects, advanced substrates, heterogeneous integration, thermal management, and system reliability, the collection demonstrates how simulation helps predict performance and reduce design iterations. Learn how simulation-driven approaches are helping engineers develop more reliable, high-performance electronic systems for next-generation applications.

IEEE EMC+SIPI 2026: Highlights from Dallas

Thu, 20 Aug 2026 00:00:16 -0400

The 2026 IEEE International Symposium on EMC and Signal/Power Integrity (IEEE EMC+SIPI) returned to Dallas, Texas, August 3-7. It’s been a while. The last time the event was here was 1993, although Austin, Texas has played host numerous times in between.

SERDES Receiver Robustness and Bit Error Rate Testing Using the J7000B Noise Generator

Fri, 14 Aug 2026 00:00:00 -0400

High-speed Serializer/Deserializer (SERDES) is the backbone of digital communication systems used in Ethernet, PCIe, data storage, and high-speed digital interfaces. This application note demonstrates how the Maury Microwave J7000B noise generator enables SERDES testing through receiver sensitivity characterization, bit error rate (BER) testing, and link margin analysis.

Can Copper Still Scale for the 448G Era?

Fri, 14 Aug 2026 00:00:00 -0400

Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.

Rohde & Schwarz Showcases Broad Range of EMC Test Solutions at EMC+SIPI 2026 in Dallas, Texas

Sat, 08 Aug 2026 00:00:00 -0400

Rohde & Schwarz will demonstrate its comprehensive portfolio of EMC test solutions, from advanced EMI receivers and oscilloscopes to high-power amplifiers, antennas, and automation software at the 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), held in Dallas, Texas from August 3 to 7.

Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms

Wed, 05 Aug 2026 01:00:00 -0400

This article describes the use of Cadence’s Sigritysignal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.

Samtec Releases 1.85 mm 30° Angled Launch Connectors

Tue, 04 Aug 2026 00:00:57 -0400

Samtec, Inc., the service leader in the connector industry, announces full production quantity availability of its new 1.85 mm 30-degree angled launch board connector (185-AL Series).

Keysight Addresses Cross-Domain Physics Issues That Leave Electronic Designs Vulnerable to Late-Stage Failure

Tue, 21 Jul 2026 16:30:00 -0400

Keysight Technologies announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs. The structural analysis application covering drop, shock, and vibration enables engineering teams to identify and fix problems earlier, before a prototype is built.

SIJ Publishes April 2026 Issue

Sat, 11 Jul 2026 00:00:59 -0400

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!

Molex Unveils Multi-Channel Liquid Cooled Busbar Capability at Computex 2026 to Power Next-Generation AI Data Centers

Tue, 07 Jul 2026 00:00:00 -0400

Molex, a global electronics leader and connectivity innovator, will showcase its latest thermal management innovations at Computex 2026 (booth M1330, 4F. TAINEX 1), led by the debut of the new Multi-Channel Liquid Cooled Busbars.

Samtec Cable-to-Cable Interconnects Support High-Density AI Architectures

Sun, 05 Jul 2026 00:00:47 -0400

Samtec, Inc., the service leader in the connector industry, announces the release of the ARJ6 cable-to-cable, high-density panel mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec's popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.