Signal Integrity Journal

New VITA 91 High Density VPX Backplanes from Pixus

Wed, 29 Apr 2026 00:00:00 -0400

Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new line of VITA 91 compliant backplanes.

New Samtec SMA Interconnects Capable of 26.5 GHz

Tue, 28 Apr 2026 00:00:00 -0400

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain

Tue, 28 Apr 2026 00:00:00 -0400

Indium Corporation today announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.

Signal Integrity IP Market To Reach USD 3.75 billion by 2033

Tue, 28 Apr 2026 00:00:00 -0400

The Signal Integrity IP market is quietly becoming one of the most influential enablers of next-generation electronics, particularly in the United States, where innovation in semiconductors, data centers, and AI hardware is accelerating at an unprecedented pace.

Next-Generation SMD High-Voltage Mica Capacitors: CM-HVLP Power, Easy Integration, and Miniaturization

Mon, 27 Apr 2026 00:00:00 -0400

Stop Breaking the Loop: Modern Closed-Loop Stability in ADS

Mon, 27 Apr 2026 00:00:00 -0400

Microchip's Plug-In Timing Module Delivers Precise, Reliable Synchronization for Data Centers and 5G Networks to Meet the Demands of AI and Next-Generation Connectivity

Thu, 23 Apr 2026 00:00:00 -0400

AI-Assisted HFSS Modeling For 100 GHz+ High-Speed Interconnect Design

Thu, 23 Apr 2026 00:00:00 -0400

AT&S Advances Glass Core Substrates for AI, High-Performance Computing and Photonics

Wed, 22 Apr 2026 00:00:00 -0400

Why Power Architectures Constrain New Space AI Missions

Wed, 22 Apr 2026 00:00:00 -0400

Ultra-Low Insertion Inductance, Ultra-High-Bandwidth Resistors

Tue, 21 Apr 2026 00:00:00 -0400

By treating the resistor as an electromagnetic structure rather than a lumped element, and by managing coupling, shielding, thermal paths, and compensation as part of a unified design, it becomes possible to achieve ultra‑low insertion inductance and gigahertz‑class measurement bandwidth in a device small enough for production use. The result is a measurement element that enhances system performance rather than limiting it. As power systems continue to push toward higher speed, higher density, and higher reliability, the current‑sense resistor must evolve accordingly. In this article, Steve Sandler outlines a path to that evolution.

Advanced Chip and Circuit Materials Introduces Negative and Near-zero CTE Materials

Mon, 20 Apr 2026 10:06:50 -0400

ACCM launched two new materials: Celeritas HM50 and Celeritas HM001.

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Mon, 20 Apr 2026 09:24:01 -0400

This article will explore the key role of digitizers in enabling state-of-the-art SSOCT systems and explain why Teledyne digitizers, including the ADQ32 and ADQ35, provide the performance, flexibility, and advanced features required by SS-OCT instrument developers striving to build next-generation imaging solutions.

The Role of Precision Timing in Enabling Higher Bandwidth Per Rack Without Compromising Signal Integrity or Efficiency

Mon, 20 Apr 2026 00:00:44 -0400

Amazon to Acquire Globalstar

Sun, 19 Apr 2026 00:00:49 -0400

Amazon.com, Inc. and Globalstar, Inc. announced that they have entered into a definitive merger agreement under which Amazon will acquire Globalstar, enabling Amazon Leo to add direct-to-device (D2D) services to its low Earth orbit satellite network and extend cellular coverage to customers beyond the reach of terrestrial networks.

Rohde & Schwarz to Host Power Electronics Online Conference “From Design to Validation” in May

Sun, 19 Apr 2026 00:00:27 -0400

Rohde & Schwarz will host the Power Electronics Online Conference “From Design to Validation” on May 5 and 6, 2026.

SIJ Publishes April 2026 Issue

Sat, 18 Apr 2026 00:00:59 -0400

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!

DesignCon 2026: AI-Driven Infrastructure and System-Level Design

Sat, 18 Apr 2026 00:00:15 -0400

The Role of Copper Pour and Picket Fence vias in Digital Designs

Fri, 17 Apr 2026 00:00:00 -0400

Sensitivity of PCIe Connector Return Loss to Mating Interface and PCB Footprint Impedance Variations

Thu, 16 Apr 2026 00:00:47 -0400

Sivers Semiconductors Collaborates With Jabil on Energy Efficient 1.6T Pluggable Optical Transceiver Module

Wed, 15 Apr 2026 08:51:13 -0400

Sivers Semiconductors AB announced a collaboration with Jabil, in which Jabil plans to develop a 1.6T LRO transceiver module using Sivers’ high-performance DFB lasers.

Samtec Cable Assemblies Test 224 Gbps PAM4

Wed, 15 Apr 2026 08:26:38 -0400

Samtec, Inc. announced the release of the BE71A Bulls Eye^® Phase & Amplitude Stable Test Assembly.

Machine Learning Models for SI/PI Analysis with Meshed Planes

Wed, 15 Apr 2026 00:00:00 -0400

Advantest Announces Opening of Strategic Innovation Center

Tue, 14 Apr 2026 11:21:39 -0400

Advantest announced the opening of two Advantest Innovation Centers, one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif.

Orbital Sets Date for First Test Mission to Put AI Data Centers in LEO

Tue, 14 Apr 2026 08:01:01 -0400

Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure.

EMC Testing for Data Centers Market to Reach USD 2.6B by 2033

Tue, 07 Apr 2026 09:10:39 -0400

According to Research Intelo, the global electromagnetic compatibility (EMC) testing for data centers market was valued at USD 1.2 billion in 2024 and is projected to reach USD 2.6 billion by 2033, expanding at a robust CAGR of 8.7 percent.

ACCM Celeritas™ SF1600 Delivers Zero-Skew for PCIe 7, 224 Gbps and Beyond

Mon, 06 Apr 2026 12:55:19 -0400

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root.

Teledyne e2v Started Production of 16 GB DDR4 -X1 Flight Models for Space Applications

Fri, 03 Apr 2026 08:10:40 -0400

Teledyne e2v announced the start of full production of its 16 GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications.

Worldwide Telecom Capex to Decline in 2026

Thu, 02 Apr 2026 08:37:52 -0400

According to a recently published report from Dell’Oro Group, worldwide telecom investments were stable in 2025.

DesignCon 2026 Engineer of the Year: Bert Simonovich

Wed, 01 Apr 2026 00:00:25 -0400