Signal Integrity Journal

Samtec Dual Functionality AcceleRate® mP Connectors Save PCB Space

Tue, 03 Nov 2026 13:53:04 -0500

Samtec, Inc. announces the release of its 10 mm stack height, AcceleRate® mP (UDM6, UDF6) combination signal pin and power blade connectors.

The Other Half of the Launch: Return-Path Considerations in Coaxial-to-GCPW Interconnects

Tue, 03 Nov 2026 00:00:00 -0500

This article begins with the same UT-20 coaxial-feedthrough-to-GCPW launch starting point used in previous AI-assisted optimization work¹and examines how coaxial conductor dimensions, top-side GCPW ground spacing, coax-to-GCPW lateral misalignment, and the coax-to-GCPW air gap affect the transition.

Maintain SI at 224 Gbps PAM4 by Moving Beyond Traditional Design Techniques

Mon, 02 Nov 2026 00:00:00 -0500

As data center systems evolve to support increasingly demanding artificial intelligence (AI) and machine-learning (ML) workloads, maintaining signal integrity at 224 Gbps PAM4 has become a major architectural challenge. One of the primary limitations is insertion loss in conventional PCB traces, which increasingly constrains performance as data rates rise. This paper explores a co-packaged interconnect approach that addresses this limitation by placing the high-speed separable interface directly on the package substrate.

The Importance of Interposers for Design Verification

Fri, 30 Oct 2026 00:00:00 -0400

Why Use DRAM Interposers for Signal Measurement?

Breaking the Memory Wall: Signal and Power Integrity Challenges of AI Scale-Up

Thu, 29 Oct 2026 00:00:02 -0400

The memory wall, once a niche topic for computer architects arguing over cache hierarchies, now shapes how AI data centers are physically built. As large language models move from training into round-the-clock inference, the industry is now pushing against the limits of physics. The problem is how to move enough bytes between memory and logic, and between accelerators, within the loss, noise, power and thermal budgets of copper, optics and power delivery networks.

The Printed Circuit Board Industry and Yole Group

Wed, 28 Oct 2026 13:00:00 -0400

Yole Group launches a new market & technology analysis, The Printed Circuit Board (PCB) Industry 2026 report.

Power Integrity Correlation of Ultra-Low-Impedance Via-Field Measurements

Wed, 28 Oct 2026 00:00:00 -0400

Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.

Modeling and Measuring Large Signal PDN Crosstalk and Ground Bounce with a Multi-Phase VRM System Using a Fast Multi-Domain BGA Step Load

Tue, 27 Oct 2026 00:00:00 -0400

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

How to Validate Chiplet Designs in the World of AI

Mon, 26 Oct 2026 00:00:00 -0400

The rise of AI and data centers is placing higher performance demands on systems than ever before, which requires increasingly advanced chiplet designs. The need to meet this level of performance has driven the development of new compliance standards for communication between chiplets with advanced packages.

Mitigation of Ionizing Radiation Degradation in Linear Regulators Using eGaN HEMTs

Mon, 26 Oct 2026 00:00:00 -0400

Traditional space LDOs rely on silicon MOSFETs that suffer from radiation degradation. To solve this, Tony Marini from EPC Space highlights a revolutionary alternative using enhancement-mode Gallium Nitride (eGaN) HEMTs. Their unique material physics inherently resists Total Ionizing Dose (TID) effects without performance loss, ensuring exceptional parameter stability in harsh orbital environments.

EMV 2027: Strong Early Bookings, International Demand, and a Future-Focused Program

Sun, 25 Oct 2026 00:00:00 -0400

Just over six months before the event begins, there is already high demand for exhibition space at the EMV 2027.

Signal Integrity Journal Welcomes Benoit Derat as Technical Advisor

Sat, 24 Oct 2026 00:00:46 -0400

Signal Integrity Journal is pleased to welcome Benoit Derat as its newest Technical Advisor.

Looking Ahead with Signal Integrity Journal

Wed, 21 Oct 2026 00:00:00 -0400

It is my privilege to introduce myself as the newest Technical Editor for Signal Integrity Journal, a role I take on alongside my full-time position as Senior Director of R&D for Compute, Storage, Optical Transport, and High-Speed Ethernet Test Solutions at VIAVI Solutions.

Signal Integrity Monitoring for Vehicles Market to Reach USD 4.37 Billion by 2034

Sun, 18 Oct 2026 00:00:00 -0400

According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.

Practical Modeling of 3D Interconnects with Hatched Ground Planes in Silicon Interposer Bridges, and Flex PCBs

Thu, 15 Oct 2026 00:00:00 -0400

This application note presents an efficient methodology for modeling 3D interconnects incorporating hatched return planes in silicon interposers, silicon bridges, and flex PCBs. The approach combines a specially designed quasi-static 2D field solver with full 3D electromagnetic analysis within a mixed-domain modeling framework.

Measuring the Noise Floor of a High-Bandwidth Oscilloscope

Thu, 15 Oct 2026 00:00:00 -0400

Learn about the sources of noise in high-speed sampling systems and how they impact measurements across ranges, bandwidth, and sampling. We will discuss the keys to avoiding measurement error and making sure to accurately compare apples to apples when discussing noise performance along with the Siglent SDS7804AP oscilloscope.

Hidden Variable in High-Speed Measurements: RF Cable Stability

Thu, 15 Oct 2026 00:00:00 -0400

At data rates of 100 Gb/s and beyond, RF cable instability can affect the accuracy, repeatability, and confidence of high-speed differential channel measurements. This white paper explores how Maury Microwave stable RF cable assemblies can help minimize cable-induced variations and create a more reliable measurement environment.

PCIe 7.0 at 128 GT/s: PAM4 Validation in Real CEM Channels

Wed, 14 Oct 2026 00:00:00 -0400

PCI Express® is accelerating to meet AI and hyperscale infrastructure demand. PCIe 7.0 reached Base Specification release in June 2025, defining performance at the ASIC pins, and the Peripheral Component Interconnect Special Interest Group (PCI-SIG) Board also announced direction pushing PCIe to 256 GT/s, signaling an accelerated roadmap beyond PCIe 7.0 128 GT/s, and reinforcing a faster standards cadence than prior generations.

Keysight Showcases Link Layer Retry Interoperability with Alibaba Cloud at 2026 OCP Global Summit

Tue, 13 Oct 2026 08:52:22 -0400

Keysight Technologies, Inc. will demonstrate multi-vendor interoperability of Link Layer Retry (LLR) for the first time in joint demonstrations with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit in San Jose, October 12 to 15.

Methods to Model and Measure Noise Mitigation with Embedded Capacitors in High Current PDNs for AI and Cloud Compute

Tue, 06 Oct 2026 00:00:00 -0400

The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.

Optical I/O for AI Chips Market to Reach USD 14 Billion by 2035

Sun, 04 Oct 2026 08:37:48 -0400

The global optical I/O for AI chips market was valued at USD 1.1 billion in 2025 and is estimated to grow at a CAGR of 27.8% to reach USD 14 billion by 2035, according to recent report by Global Market Insights Inc.

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects for Next-Generation AI Data Centers

Sun, 27 Sep 2026 13:14:22 -0400

Molex, a global electronics leader and connectivity innovator, introduced VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks.

HYPERLABS Expands 145 GHz Component Line with New HL8818 Broadband Termination

Fri, 25 Sep 2026 00:00:00 -0400

HYPERLABS has expanded its 0.8 mm, 145 GHz component series with the introduction of the HL8818 Broadband 50Ω Termination.

Samtec to Exhibit at ECOC 2026

Wed, 16 Sep 2026 00:00:25 -0400

Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high performance optical and copper interconnect solutions in booth #2004 at the upcoming ECOC exhibition.

Wi2Wi Announces US$2.6 M Three-Year Contract with a Confidential Defense Organization, Stock Option Grant and Investor Relations Engagement

Mon, 14 Sep 2026 00:00:00 -0400

Wi2Wi Corporation announces that it has entered into a three-year contract, valued at US$2.6 million, with a confidential defense organization for Precision Devices products for an aerospace application.

Samtec 1.0 mm Connectors Capable of DC to 120 GHz

Sun, 13 Sep 2026 00:00:00 -0400

Samtec, Inc. announces the release of its 1.0 mm vertical compression mount board connector, the 100-CM Series.

VIAVI Joins EU-Funded SHIELD-6G Consortium to Advance AI-Driven Security Testing for Future 6G Networks

Sun, 06 Sep 2026 00:00:50 -0400

VIAVI Solutions Inc. announced that it has been awarded $1.1 million in funding from the European Smart Networks and Services Joint Undertaking (SNS JU) and Horizon Europe to advance the SHIELD-6G project.

Maintaining Signal Integrity in Automated Production

Sat, 05 Sep 2026 00:00:47 -0400

While global manufacturing continues to push toward more automated production, unplanned outages now cost the sector an average of $852 million every week. As factories integrate high-speed data signals alongside mixed-voltage power architectures, the physical layer has become a determining factor in system stability rather than a background consideration.

When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Wed, 02 Sep 2026 00:00:00 -0400

PAM2 vs. PAM4 Signaling: Simply Explained

Tue, 01 Sep 2026 00:00:00 -0400