<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0" xmlns:media="http://search.yahoo.com/mrss/" xmlns:content="http://purl.org/rss/1.0/modules/content/">
  <channel>
    <title>Signal Integrity Journal</title>
    <description>Signal Integrity Journal, a sister publication to Microwave Journal,</description>
    <link>https://www.signalintegrityjournal.com/rss/articles</link>
    <item>
      <title>SERDES Receiver Robustness and Bit Error Rate Testing Using the J7000B Noise Generator</title>
      <description>High-speed Serializer/Deserializer (SERDES) is the backbone of digital communication systems used in Ethernet, PCIe, data storage, and high-speed digital interfaces. This application note demonstrates how the Maury Microwave J7000B noise generator enables SERDES testing through receiver sensitivity characterization, bit error rate (BER) testing, and link margin analysis.</description>
      <content:encoded>
        <![CDATA[<p>High-speed Serializer/Deserializer (SERDES) is the backbone of digital communication systems used in Ethernet, PCIe, data storage, and high-speed digital interfaces. This application note demonstrates how the Maury Microwave J7000B noise generator enables SERDES testing through receiver sensitivity characterization, bit error rate (BER) testing, and link margin analysis.</p>]]>
      </content:encoded>
      <pubDate>Fri, 14 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4345-serdes-receiver-robustness-and-bit-error-rate-testing-using-the-j7000b-noise-generator</link>
      <guid>http://www.signalintegrityjournal.com/articles/4345</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/White-papers-App-notes/2026/Aug_26/MauryMicrowave_WP_serdes_receiver_robustness_Cvr150.webp?t=1786685366" type="image/jpeg" length="7755"/>
    </item>
    <item>
      <title>Can Copper Still Scale for the 448G Era?</title>
      <description>Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.</description>
      <content:encoded>
        <![CDATA[<p>Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.</p>]]>
      </content:encoded>
      <pubDate>Fri, 14 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4344-can-copper-still-scale-for-the-448g-era</link>
      <guid>http://www.signalintegrityjournal.com/articles/4344</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/White-papers-App-notes/2026/Aug_26/TEConnectivity_WP_SIJAug26_DDN_Technical-Paper_400G-Channels-for-AI-Applications_Cvr150x194.webp?t=1786685365" type="image/jpeg" length="12337"/>
    </item>
    <item>
      <title>IEEE EMC+SIPI 2026: Highlights from Dallas</title>
      <description>The 2026 IEEE International Symposium on EMC and Signal/Power Integrity (IEEE EMC+SIPI) returned to Dallas, Texas, August 3-7. It’s been a while. The last time the event was here was 1993, although Austin, Texas has played host numerous times in between.</description>
      <content:encoded>
        <![CDATA[<p>The 2026 IEEE International Symposium on EMC and Signal/Power Integrity 
 (IEEE EMC+SIPI) returned to Dallas, Texas, August 3-7. It’s been a 
 while. The last time the event was here was 1993, although Austin, Texas
 has played host numerous times in between.
</p>]]>
      </content:encoded>
      <pubDate>Thu, 13 Aug 2026 00:00:16 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4343-ieee-emcsipi-2026-highlights-from-dallas</link>
      <guid>http://www.signalintegrityjournal.com/articles/4343</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/images/IEEE-EMCSIPI.webp?t=1786485406" type="image/jpeg" length="305546"/>
    </item>
    <item>
      <title>When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <pubDate>Wed, 12 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4287-when-frequency-shapes-time-how-s-parameter-properties-shape-simulated-tdr-behavior</link>
      <guid>http://www.signalintegrityjournal.com/articles/4287</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/4287-When-Frequency-Shapes-Time.webp?t=1778472267" type="image/png" length="57664"/>
    </item>
    <item>
      <title>PAM2 vs. PAM4 Signaling: Simply Explained </title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <pubDate>Tue, 11 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4288-pam2-vs-pam4-signaling-simply-explained</link>
      <guid>http://www.signalintegrityjournal.com/articles/4288</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/4288-PAM2-vs.-PAM4.webp?t=1779077063" type="image/png" length="83294"/>
    </item>
    <item>
      <title>Signal Integrity Monitoring for Vehicles Market to Reach USD 4.37 Billion by 2034</title>
      <description>According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.</span>
</p>]]>
      </content:encoded>
      <pubDate>Mon, 10 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4336-signal-integrity-monitoring-for-vehicles-market-to-reach-usd-437-billion-by-2034</link>
      <guid>http://www.signalintegrityjournal.com/articles/4336</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/EVs.webp?t=1783451604" type="image/png" length="241736"/>
    </item>
    <item>
      <title>VIAVI Joins EU-Funded SHIELD-6G Consortium to Advance AI-Driven Security Testing for Future 6G Networks</title>
      <description>VIAVI Solutions Inc. announced that it has been awarded $1.1 million in funding from the European Smart Networks and Services Joint Undertaking (SNS JU) and Horizon Europe to advance the SHIELD-6G project.</description>
      <content:encoded>
        <![CDATA[<p>VIAVI Solutions Inc. announced that it has been awarded $1.1 million in funding from the European Smart Networks and Services Joint Undertaking (SNS JU) and Horizon Europe to advance the SHIELD-6G project.</p>]]>
      </content:encoded>
      <pubDate>Sun, 09 Aug 2026 00:00:50 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4337-viavi-joins-eu-funded-shield-6g-consortium-to-advance-ai-driven-security-testing-for-future-6g-networks</link>
      <guid>http://www.signalintegrityjournal.com/articles/4337</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/VIAVI.2.webp?t=1784035410" type="image/png" length="31157"/>
    </item>
    <item>
      <title>Rohde &amp; Schwarz Showcases Broad Range of EMC Test Solutions at EMC+SIPI 2026 in Dallas, Texas</title>
      <description>Rohde &amp; Schwarz will demonstrate its comprehensive portfolio of EMC test solutions, from advanced EMI receivers and oscilloscopes to high-power amplifiers, antennas, and automation software at the 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal &amp; Power Integrity (EMC+SIPI), held in Dallas, Texas from August 3 to 7.</description>
      <content:encoded>
        <![CDATA[<p>Rohde & Schwarz will demonstrate its comprehensive portfolio of EMC test solutions, from advanced EMI receivers and oscilloscopes to high-power amplifiers, antennas, and automation software at the 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), held in Dallas, Texas from August 3 to 7.</p>]]>
      </content:encoded>
      <pubDate>Sat, 08 Aug 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4340-rohde-and-schwarz-showcases-broad-range-of-emc-test-solutions-at-emcsipi-2026-in-dallas-texas</link>
      <guid>http://www.signalintegrityjournal.com/articles/4340</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/RS-EMC-Dallas.webp?t=1785174047" type="image/png" length="310385"/>
    </item>
    <item>
      <title>Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms</title>
      <description>This article describes the use of Cadence’s Sigrity signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.</description>
      <content:encoded>
        <![CDATA[<p>This article describes the use of Cadence’s&nbsp;Sigrity<sup>&nbsp;</sup>signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.</p>]]>
      </content:encoded>
      <pubDate>Wed, 05 Aug 2026 01:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4099-optimization-of-ibis-ami-model-parameters-with-machine-learning-algorithms</link>
      <guid>http://www.signalintegrityjournal.com/articles/4099</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2025/thumb/Cadence-Cover-1025m28.webp?t=1762233479" type="image/png" length="62772"/>
    </item>
    <item>
      <title>Samtec Releases 1.85 mm 30° Angled Launch Connectors</title>
      <description>Samtec, Inc., the service leader in the connector industry, announces full production quantity availability of its new 1.85 mm 30-degree angled launch board connector (185-AL Series).</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Samtec, Inc., the service leader in the connector industry, announces full production quantity availability of its new 1.85 mm 30-degree angled launch board connector (185-AL Series).&nbsp;</span>
</p>]]>
      </content:encoded>
      <pubDate>Tue, 04 Aug 2026 00:00:57 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4338-samtec-releases-185-mm-30-angled-launch-connectors</link>
      <guid>http://www.signalintegrityjournal.com/articles/4338</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/SAMTEC-launch-connectors.webp?t=1784057594" type="image/png" length="93414"/>
    </item>
    <item>
      <title>Keysight Addresses Cross-Domain Physics Issues That Leave Electronic Designs Vulnerable to Late-Stage Failure</title>
      <description>Keysight Technologies announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs. The structural analysis application covering drop, shock, and vibration enables engineering teams to identify and fix problems earlier, before a prototype is built.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Keysight Technologies announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs. The structural analysis application covering drop, shock, and vibration enables engineering teams to identify and fix problems earlier, before a prototype is built.</span>
</p>]]>
      </content:encoded>
      <pubDate>Tue, 21 Jul 2026 16:30:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4339-keysight-addresses-cross-domain-physics-issues-that-leave-electronic-designs-vulnerable-to-late-stage-failure</link>
      <guid>http://www.signalintegrityjournal.com/articles/4339</guid>
    </item>
    <item>
      <title>SIJ Publishes April 2026 Issue</title>
      <description>Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!</description>
      <content:encoded>
        <![CDATA[<p><em>Signal Integrity Journal</em>, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!</p>]]>
      </content:encoded>
      <pubDate>Sat, 11 Jul 2026 00:00:59 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4290-sij-publishes-april-2026-issue</link>
      <guid>http://www.signalintegrityjournal.com/articles/4290</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/2026/04/14/SIJ-APRIL-650-x-488.webp?t=1776184516" type="image/jpeg" length="233065"/>
    </item>
    <item>
      <title>Molex Unveils Multi-Channel Liquid Cooled Busbar Capability at Computex 2026 to Power Next-Generation AI Data Centers</title>
      <description>Molex, a global electronics leader and connectivity innovator, will showcase its latest thermal management innovations at Computex 2026 (booth M1330, 4F. TAINEX 1), led by the debut of the new Multi-Channel Liquid Cooled Busbars.</description>
      <content:encoded>
        <![CDATA[<p>Molex, a global electronics leader and connectivity innovator, will showcase its latest thermal management innovations at Computex 2026 (booth M1330, 4F. TAINEX 1), led by the debut of the new Multi-Channel Liquid Cooled Busbars.</p>]]>
      </content:encoded>
      <pubDate>Tue, 07 Jul 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4330-molex-unveils-multi-channel-liquid-cooled-busbar-capability-at-computex-2026-to-power-next-generation-ai-data-centers</link>
      <guid>http://www.signalintegrityjournal.com/articles/4330</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/LCBB-Molex.webp?t=1780493317" type="image/png" length="252210"/>
    </item>
    <item>
      <title>Samtec Cable-to-Cable Interconnects Support High-Density AI Architectures</title>
      <description>Samtec, Inc., the service leader in the connector industry, announces the release of the ARJ6 cable-to-cable, high-density panel mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec's popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.</description>
      <content:encoded>
        <![CDATA[<p style="box-sizing: inherit; font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px;">Samtec, Inc., the service leader in the connector industry, announces the release of the ARJ6 cable-to-cable, high-density panel mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec's popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.</p>]]>
      </content:encoded>
      <pubDate>Sun, 05 Jul 2026 00:00:47 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4334-samtec-cable-to-cable-interconnects-support-high-density-ai-architectures</link>
      <guid>http://www.signalintegrityjournal.com/articles/4334</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/ARJ6-PR-image-1800x1200.webp?t=1781644087" type="image/jpeg" length="231546"/>
    </item>
    <item>
      <title>Materials for AI Data Centers, Silicon Photonics, and Quantum Computing at IICIE 2026</title>
      <description>YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026, taking place September 9 to 11, 2026, in Shenzhen, China.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026, taking place September 9 to 11, 2026, in Shenzhen, China.</span>
</p>]]>
      </content:encoded>
      <pubDate>Wed, 24 Jun 2026 15:39:08 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4335-materials-for-ai-data-centers-silicon-photonics-and-quantum-computing-at-iicie-2026</link>
      <guid>http://www.signalintegrityjournal.com/articles/4335</guid>
    </item>
    <item>
      <title>Power Integrity Analysis AI Market To Reach USD 3,335.1 Million by 2033</title>
      <description>According to our Growth Market Report, the global Power Integrity Analysis AI market size reached USD 712.4 million in 2024, registering a robust growth trajectory. The market is projected to expand at a CAGR of 18.7% from 2025 to 2033, reaching an estimated USD 3,335.1 million by 2033.</description>
      <content:encoded>
        <![CDATA[<p>According to our <strong>Growth Market Report</strong>, the global Power Integrity Analysis AI market size reached USD 712.4 million in 2024, registering a robust growth trajectory. The market is projected to expand at a CAGR of 18.7% from 2025 to 2033, reaching an estimated USD 3,335.1 million by 2033.&nbsp;</p>]]>
      </content:encoded>
      <pubDate>Mon, 15 Jun 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4331-power-integrity-analysis-ai-market-to-reach-usd-3-3351-million-by-2033</link>
      <guid>http://www.signalintegrityjournal.com/articles/4331</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/Power-Integrity-Analysis-AI.webp?t=1780504524" type="image/png" length="284210"/>
    </item>
    <item>
      <title>Signal Hound Adds Pulse Analysis Tool Kit to Spike</title>
      <description>Today Signal Hound – manufacturer of accessible, versatile, precision test equipment – announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.</description>
      <content:encoded>
        <![CDATA[<p>Today <strong>Signal Hound</strong> – manufacturer of accessible, versatile, precision test equipment – announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.</p>]]>
      </content:encoded>
      <pubDate>Wed, 03 Jun 2026 16:30:34 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4333-signal-hound-adds-pulse-analysis-tool-kit-to-spike</link>
      <guid>http://www.signalintegrityjournal.com/articles/4333</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/Pulse-600x400.webp?t=1780521520" type="image/png" length="241298"/>
    </item>
    <item>
      <title>Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK</title>
      <description>Keysight Technologies, Inc. (NYSE: KEYS) announced support for GlobalFoundries’ (GF) silicon photonics process technology in its Advanced Design System (ADS) Photonic Designer, expanding its foundry ecosystem for photonic integrated circuit (PIC) development.</description>
      <content:encoded>
        <![CDATA[<p><strong>Keysight Technologies, Inc.</strong> (NYSE: KEYS) announced support for GlobalFoundries’ (GF) silicon photonics process technology in its Advanced Design System (ADS) Photonic Designer, expanding its foundry ecosystem for photonic integrated circuit (PIC) development.&nbsp;</p>]]>
      </content:encoded>
      <pubDate>Wed, 03 Jun 2026 12:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4332-keysight-expands-photonics-design-ecosystem-with-globalfoundries-pdk</link>
      <guid>http://www.signalintegrityjournal.com/articles/4332</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/2026/06/11/Keysight-expands-Pho-Design.webp?t=1781186777" type="image/jpeg" length="33283"/>
    </item>
    <item>
      <title>IMS2026: The RF and Microwave Event Comes to Boston, June 7–12</title>
      <description>The 2026 IEEE International MTT Symposia (IMS2026) convenes 7-12 June 2026 at the Thomas M. Menino Convention and Exhibition Center (MCEC), bringing 500+ exhibiting companies and more than 8,000 engineers, researchers, academics, and technology leaders from around the world to Boston.</description>
      <content:encoded>
        <![CDATA[<p>The <strong><span style=" font-style: inherit; font-weight: inherit;"><a data-auth="NotApplicable" data-linkindex="1" href="https://nam10.safelinks.protection.outlook.com/?url=https%3A%2F%2Fu7061146.ct.sendgrid.net%2Fls%2Fclick%3Fupn%3Du001.gqh-2BaxUzlo7XKIuSly0rCyyy-2BF9VwgAbupPGdeO-2Fp1w-3DXltb_fgsw7j7FnMiencOe5GpKz6R-2FJjnb0GobKoPYCGTHxWZBbU4Q3-2FJCPXKhDDDRK0BeZdTpOt9weXCFjY4jJ-2BNgyfhPXg8ELvrBYrTUY-2BIZMbAOlEdCBUo2oIbYZb3xRk7IooICKF1QCx5GoA8cFR5BCOrt28-2BuBs7Gaw7YC1e5OUMneVbwX1uyC1wdKi1JpfPdbz8koSBvcQNFrWJX8-2BrdAetiXKCl90mNdK7KNzQVUR5hDT3U2y0btGfg6P-2BAoi8BO-2FBhA-2FSy7dYUOw0sI-2FBD3TtdnFQvzXWsZcnrNCDiHeNM1Vmh1bVQv9bpFxdkR9DPFQct-2F2LLtlKrSqZWYtDjGA-3D-3D&data=05%7C02%7Cphall%40horizonhouse.com%7C0061da05ebd843d80c3808deab87cbec%7C85f2fc98a3c44064815d1efc67da1928%7C0%7C0%7C639136796891267697%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=PCGIlI5517FYgjf2lui6%2Bgmp%2BoMa3hPiRi%2FloFC0kng%3D&reserved=0" title="Original URL: https://u7061146.ct.sendgrid.net/ls/click?upn=u001.gqh-2BaxUzlo7XKIuSly0rCyyy-2BF9VwgAbupPGdeO-2Fp1w-3DXltb_fgsw7j7FnMiencOe5GpKz6R-2FJjnb0GobKoPYCGTHxWZBbU4Q3-2FJCPXKhDDDRK0BeZdTpOt9weXCFjY4jJ-2BNgyfhPXg8ELvrBYrTUY-2BIZMbAOlEdCBUo2oIbYZb3xRk7IooICKF1QCx5GoA8cFR5BCOrt28-2BuBs7Gaw7YC1e5OUMneVbwX1uyC1wdKi1JpfPdbz8koSBvcQNFrWJX8-2BrdAetiXKCl90mNdK7KNzQVUR5hDT3U2y0btGfg6P-2BAoi8BO-2FBhA-2FSy7dYUOw0sI-2FBD3TtdnFQvzXWsZcnrNCDiHeNM1Vmh1bVQv9bpFxdkR9DPFQct-2F2LLtlKrSqZWYtDjGA-3D-3D. Click or tap if you trust this link.">2026 IEEE International MTT Symposia (IMS2026)</a></span></strong> convenes 7-12 June 2026 at the Thomas M. Menino Convention and Exhibition Center (MCEC), bringing 500+ exhibiting companies and more than 8,000 engineers, researchers, academics, and technology leaders from around the world to Boston.</p>]]>
      </content:encoded>
      <pubDate>Sun, 31 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4316-ims2026-the-rf-and-microwave-event-comes-to-boston-june-712</link>
      <guid>http://www.signalintegrityjournal.com/articles/4316</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/ims2026_400x600.webp?t=1778090391" type="image/jpeg" length="118560"/>
    </item>
    <item>
      <title>Highly Reliable Electronic Components Drive Medical Innovations</title>
      <description>Designing the next generation of wireless wearables, implantables, and real-time external or in-body monitoring devices is a complex challenge that requires highly reliable electronic components that greatly exceed the performance of standard commercial alternatives.</description>
      <content:encoded>
        <![CDATA[<p style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: start; widows: 2; word-spacing: 0px;"><span data-olk-copy-source="MessageBody" style=" font-style: inherit; font-weight: inherit;">Designing the next generation of wireless wearables, implantables, and real-time external or in-body monitoring devices is a complex challenge that requires highly reliable electronic components that greatly exceed the performance of standard commercial alternatives.</span></p>]]>
      </content:encoded>
      <pubDate>Tue, 26 May 2026 09:54:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4328-highly-reliable-electronic-components-drive-medical-innovations</link>
      <guid>http://www.signalintegrityjournal.com/articles/4328</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/Johanson-600x400.webp?t=1779392556" type="image/png" length="181334"/>
    </item>
    <item>
      <title>Infineon CoolGaN™ BDS 40 V G3 Family Delivers up to 82 Percent Footprint Reduction for Portable Power Designs</title>
      <description>Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S.&nbsp;</span>
</p>]]>
      </content:encoded>
      <pubDate>Mon, 25 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4325-infineon-coolgan-bds-40-v-g3-family-delivers-up-to-82-percent-footprint-reduction-for-portable-power-designs</link>
      <guid>http://www.signalintegrityjournal.com/articles/4325</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/Infineon-CoolGan.webp?t=1779289297" type="image/png" length="165619"/>
    </item>
    <item>
      <title>Keysight Enables End-to-End Electrical-Optical-Electrical Simulation for Data Center and Ethernet Design </title>
      <description>Keysight Technologies, Inc. (NYSE: KEYS) today introduced an Electrical-Optical-Electrical (EOE) simulation solution in ADS 2026. Engineers can now simulate electrical-to-optical-to-electrical signal chains within a single design environment.</description>
      <content:encoded>
        <![CDATA[<p><strong><a data-auth="NotApplicable" data-linkindex="0" href="https://nam10.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.keysight.com%2F&data=05%7C02%7Cphall%40horizonhouse.com%7C3af08924cbfe4c207ba808deb76f07fe%7C85f2fc98a3c44064815d1efc67da1928%7C0%7C0%7C639149884707161565%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=apI8dYx5Zee6QDmO0n91H3hmfJkEwVtOnnu28s1f%2B5Y%3D&reserved=0" title="Original URL: http://www.keysight.com/. Click or tap if you trust this link."><span style=" font-style: inherit; font-weight: inherit;">Keysight Technologies, Inc.</span></a></strong><span style=" font-style: inherit; font-weight: inherit;"><strong>&nbsp;</strong>(NYSE: KEYS) today introduced an Electrical-Optical-Electrical (EOE) simulation solution in ADS 2026. Engineers can now simulate electrical-to-optical-to-electrical signal chains within a single design environment.</span></p>]]>
      </content:encoded>
      <pubDate>Thu, 21 May 2026 13:04:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4329-keysight-enables-end-to-end-electrical-optical-electrical-simulation-for-data-center-and-ethernet-design</link>
      <guid>http://www.signalintegrityjournal.com/articles/4329</guid>
    </item>
    <item>
      <title>Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era</title>
      <description>Analog Devices, Inc. (NASDAQ: ADI) and Empower Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.</description>
      <content:encoded>
        <![CDATA[<p style="box-sizing: border-box; overflow-wrap: break-word; font-weight: 400; letter-spacing: 0.1px; font-style: normal; orphans: 2; text-align: start; widows: 2; word-spacing: 0px;"><strong>Analog Devices, Inc</strong>. (NASDAQ: <a href="http://finance.yahoo.com/quote/ADI?ltr=1" rel="noopener noreferrer" style="box-sizing: border-box; min-height: 24px; display: inline-block; cursor: pointer;" target="_blank">ADI</a>) and Empower Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.</p>]]>
      </content:encoded>
      <pubDate>Wed, 20 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4327-analog-devices-to-acquire-empower-semiconductor-expanding-its-next-generation-high-density-power-portfolio-for-the-ai-era</link>
      <guid>http://www.signalintegrityjournal.com/articles/4327</guid>
    </item>
    <item>
      <title>Richardson Electronics Announces Strategic Technology Partnership with NoMIS Power to Advance Silicon Carbide Solutions</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <pubDate>Wed, 20 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4326-richardson-electronics-announces-strategic-technology-partnership-with-nomis-power-to-advance-silicon-carbide-solutions</link>
      <guid>http://www.signalintegrityjournal.com/articles/4326</guid>
    </item>
    <item>
      <title>Outside China, 5G Drives Core Network Revenue Even Higher,
According to Dell’Oro Group</title>
      <description>According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, 5G Mobile Core Network (MCN) revenue grew at double-digit rates outside China, whereas in China revenues dropped more severely than any quarter since 5G was introduced to the market.</description>
      <content:encoded>
        <![CDATA[<p style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; widows: 2; word-spacing: 0px; text-align: justify;"><span data-olk-copy-source="MessageBody" style=" font-style: inherit; font-weight: inherit;">According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, 5G Mobile Core Network (MCN) revenue grew at double-digit rates outside China, whereas in China revenues dropped more severely than any quarter since 5G was introduced to the market.</span></p>]]>
      </content:encoded>
      <pubDate>Tue, 19 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4324-outside-china-5g-drives-core-network-revenue-even-higher-according-to-delloro-group</link>
      <guid>http://www.signalintegrityjournal.com/articles/4324</guid>
    </item>
    <item>
      <title>Optical Transport Equipment Market Forecast to Grow 16 Percent in 2026,
According to Dell’Oro Group</title>
      <description>According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the Optical Transport equipment market is forecast to grow 16 percent in 2026, surpassing $18 billion in manufacturer revenue for the first time since the year 2000, due to the rising demand for network infrastructure brought on by AI data centers.</description>
      <content:encoded>
        <![CDATA[<p><span data-olk-copy-source="MessageBody">According to a recently published report from Dell’Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the Optical Transport equipment market is forecast to grow 16 percent in 2026, surpassing $18 billion in manufacturer revenue for the first time since the year 2000, due to the rising demand for network infrastructure brought on by AI data centers.</span>
</p>]]>
      </content:encoded>
      <pubDate>Tue, 19 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4323-optical-transport-equipment-market-forecast-to-grow-16-percent-in-2026-according-to-delloro-group</link>
      <guid>http://www.signalintegrityjournal.com/articles/4323</guid>
    </item>
    <item>
      <title>Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <pubDate>Tue, 19 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4321-emerson-unveils-ai-ready-test-automation-platform-at-annual-ni-connect-conference</link>
      <guid>http://www.signalintegrityjournal.com/articles/4321</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/NI-Connect-600x400.webp?t=1778697522" type="image/png" length="370308"/>
    </item>
    <item>
      <title>Evolution of the PDN Design Process: Explaining the Second Paradigm Shift</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <pubDate>Sun, 17 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4286-evolution-of-the-pdn-design-process-explaining-the-second-paradigm-shift</link>
      <guid>http://www.signalintegrityjournal.com/articles/4286</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/4286-Evolution-of-the-PDN.webp?t=1777867455" type="image/png" length="75439"/>
    </item>
    <item>
      <title>3D Interconnect Designer: Physically Accurate Design and Exploration of Advanced 2.5D and 3D Interconnects</title>
      <description>This solution brief introduces Keysight 3D Interconnect Designer, a physically aware environment for early exploration and validation of advanced interconnect architectures. It enables modeling and analysis of complex 2.5D and 3D structures during the architectural phase, helping teams reduce risk, accelerate development, and improve confidence before detailed physical implementation.</description>
      <content:encoded>
        <![CDATA[<p>This solution brief introduces Keysight 3D Interconnect Designer, a physically aware environment for early exploration and validation of advanced interconnect architectures. It enables modeling and analysis of complex 2.5D and 3D structures during the architectural phase, helping teams reduce risk, accelerate development, and improve confidence before detailed physical implementation.</p>]]>
      </content:encoded>
      <pubDate>Fri, 15 May 2026 09:34:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4322-3d-interconnect-designer-physically-accurate-design-and-exploration-of-advanced-25d-and-3d-interconnects</link>
      <guid>http://www.signalintegrityjournal.com/articles/4322</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/White-papers-App-notes/2026/May_26/Keysight_WP_3DInterconnectDesignerPhysicallyAccurateDesignandExplorationAdvanced25D3DInterconnects_Cvr150.webp?t=1778864708" type="image/jpeg" length="6486"/>
    </item>
    <item>
      <title>New AWG Function Accelerates Automated Testing Processes</title>
      <description>Spectrum Instrumentation, a leading provider of more than 70 high-performance AWG products for all kinds of industries, now presents an additional AWG mode for automated testing environments.</description>
      <content:encoded>
        <![CDATA[<p><strong>Spectrum Instrumentation</strong>, a leading provider of more than 70 high-performance AWG products for all kinds of industries, now presents an additional AWG mode for automated testing environments.</p>]]>
      </content:encoded>
      <pubDate>Wed, 13 May 2026 00:00:00 -0400</pubDate>
      <link>https://www.signalintegrityjournal.com/articles/4320-new-awg-function-accelerates-automated-testing-processes</link>
      <guid>http://www.signalintegrityjournal.com/articles/4320</guid>
      <enclosure url="https://www.signalintegrityjournal.com/ext/resources/article-images-2026/Spectrum-600x400.webp?t=1778682945" type="image/png" length="227358"/>
    </item>
  </channel>
</rss>
