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The decarbonization trend will result in strong market growth for power semiconductors, in particular those based on wide bandgap materials. Infineon Technologies AG is now taking a further, decisive step to shape this market by significantly expanding its Kulim fab.
Nearfield Instruments B.V. has launched AUDIRA™—the industry’s first and only in-line, non-destructive subsurface metrology system for advanced semiconductor manufacturing.
The increasing demand for data processing is the primary driving force behind the growth in four key application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies.
Leaders from industry, government, and academia convened at a summit on April 18 in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
Nexperia’s NEH2000BY will enable the development of electronic devices that are self-powered, smaller, and environmentally friendly. This energy harvesting solution can help mitigate the environmental impact of the billions of batteries produced and discarded each year.
Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.
IDTechEx’s new “Automotive Semiconductors 2023-2033” report focuses on the areas of automation and electrification, explaining what semiconductor technologies are needed and how their growth is going to drive a 10-year CAGR of 9.4% in the automotive semiconductor market.
Infineon Technologies AG is strengthening its market leadership in power semiconductors by adding manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors.
EDI CON China 2020, held at the CNCC in Beijing, the finalists and winners of the EDI CON Product Innovation Awards were announced in three categories: Cables, Connectors & Materials; Semiconductors; and Test & Measurement.