Items Tagged with 'Samtec'

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.

Samtec has expanded its successful line of Edge Rate board-to-board connectors to include a higher density mated set that is half the width of previous designs and offers a lower-profile 5 mm mated height.

As a Diamond Sponsor of the event, Samtec will showcase products that support a new era of high-speed connectivity, and Samtec engineers will participate in 11 papers, panels, or presentations.

Samtec, Inc. is shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.

Samtec, Inc.’s Generate high-speed edge card sockets (HSEC6-DV Series) support 64 Gbps PAM4 (32 Gbps NRZ) applications and are PCIe 6.0 capable. 

Spanning DC to 90 GHz, Samtec's new connectors are well suited for use in high frequency test and measurement applications and are available in full production quantities.

Samtec, Inc. has announced the grand opening of its new design and manufacturing center in Taiwan.

Samtec has announced the opening of its newest manufacturing facility in Royersford, Pa.

In preparation for 224 Gb/s and beyond, Samtec engaged in a research project to characterize the transmission performance of emerging PCB material sets. Brandon Gore explores the current state of the art for PCBs and cables, comparing them and assessing the technology gap to fully support the insertion loss performance required for higher data rates.