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Best IoT Board Design Practices: Balancing Density, Cost, Low Power, and Mixed Signal

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When

6/28/18 11:00 am to 6/28/18 12:00 pm EST

Event Description



Title:  Best IoT Board Design Practices: Balancing Density, Cost, Low Power, and Mixed Signal

Date:  June 28, 2018

Time:  8am PT/ 11am ET

Presented By:  Rick Hartley, Principal of RHartley Enterprises 

Sponsored by:  Rohde & Schwarz USA

Abstract:

IoT applications with an embedded controller, sensors, actuators and a wireless interface are proliferating in many applications.  Most of these designs are cost driven, low power driven and with a specific form factor. These constraints often require a 2 layer board. By following a few common design guidelines, it's possible to engineer 2-layer IoT boards with remarkably good performance. We'll introduce the seven most important design guidelines useful for all IoT boards which reduce the chance of SI/PI and EMI problems.

Who should attend:

Anyone working with IoT applications, sensors, embedded controller or small wireless boards. Useful for hardware engineers, layout engineers and product engineers. 

Presenter Bio:

Rick Hartley recently served as senior principal engineer at L-3 Avionics Systems and is the principal of RHartley Enterprises, through which he consults and teaches internationally to resolve noise, signal integrity and EMI problems. Focusing on the correct design of PC boards to prevent and/or solve problems, he has consulted with major corporations in the US and 12 other countries. His work focuses on circuits and PC boards for computers, aircraft avionics and telecommunications, as well as the automotive and appliance space. Rick has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, and IPC Apex/Expo. He is a member of the executive board of the IPC Designers Council and has written numerous technical papers and articles on methods to control noise, EMI, and signal integrity.

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